METHOD FOR FORMING MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) PACKAGE

• US 20110165717A1
• Filed: 03/21/2011
• Published: 07/07/2011
• Est. Priority Date: 09/03/2008
• Status: Active Grant

• Current Assignee: Solid State System Co., Ltd.
• Original Assignee: Solid State System Co., Ltd.
• Inventors: Lin, Chih-Hsiang, Lee, Chien-Hsing, Hsieh, Tsung-Min
• Granted Patent: US 8,043,897 B2
• Time in Patent Office: Days
• US Class Current: 438/50
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A method for forming a micro-electro-mechanical systems (MEMS) package includes following steps. A plurality of MEMS units are formed on a substrate, and each of the MEMS units includes at least a MEMS sensing element and a first chamber over the MEMS sensing element. The MEMS units include electric connection pads. A plurality of covering units are formed correspondingly over the MEMS units. Each of the covering units provides a second chamber over the MEMS sensing element opposite to the first chamber. The covering units are adhered to the MEMS units by an adhesive material. The MEMS units are diced into singulated units.

Claims

1. A method for forming a micro-electro-mechanical systems (MEMS) package, comprising:

forming a plurality of MEMS units on a substrate, wherein each of the MEMS units comprises at least one MEMS sensing element and a first chamber over the at least one MEMS sensing element, wherein the MEMS units include electric connection pads;

forming a plurality of covering units correspondingly over the MEMS units, wherein each of the covering units provides a second chamber over the at least one MEMS sensing element opposite to the first chamber;

adhering the covering units to the MEMS units by an adhesive material; and

dicing the MEMS units into singulated units.

2. The method of claim 1, wherein the at least one MEMS sensing element includes a MEMS microphone structure, wherein the first chamber formed in the substrate has an opening opposite to the at least one MEMS sensing element, and the first chamber is coupled to environment acoustically via the opening.

3. The method of claim 1, wherein the covering units include an adhesive material on the surface of the covering units facing the MEMS units.

4. The method of claim 3, wherein the adhesive material includes conductive material or conductive epoxy.

5. The method of claim 1, wherein the covering units include an interconnection structure, wherein the interconnection structure includes a conductive paste.

6. The method of claim 5, wherein the conductive paste is B-stage conductive epoxy or solder paste.

7. The method of claim 5, wherein the adhesive material and the conductive paste are formed as a bonding structure in a ring to surround the at least one MEMS sensing element.

8. The method of claim 1, wherein the covering units include an interconnection structure, wherein the interconnection structure includes a metal bump.

9. The method of claim 8, wherein the metal bump is a stud bump.

10. The method of claim 1, wherein the MEMS units include a metal bump on the connection pad.

11. The method of claim 10, wherein the metal bump is a stud bump.

12. The method of claim 1, wherein the covering units are formed on the substrate in joining together as a portion of the substrate.

13. The method of claim 1, further comprising fowling the adhesive materials as a plurality of rings on the substrate to surround the MEMS sensing elements, the covering units being adhered to the substrate by the adhesive materials.

14. The method of claim 1, further comprising forming the adhesive material as a ring to surround the at least one MEMS sensing element and further forming a bonding structure at outside of the ring.

15. The method of claim 1, wherein the covering units are formed on a continuous substrate with a joining portion, and the step of dicing the MEMS units comprises:

removing the joining portion by etching; and

dicing the continuous substrate of the MEMS units.

16. The method of claim 1, before dicing the MEMS units, further comprising forming a supporting layer under the substrate of the MEMS units covering the first chamber to protect the at least one MEMS sensing element from water jet during dicing.

17. The method of claim 16, before dicing the MEMS units, further comprising forming a protection layer over the covering units at an opposite side to the supporting layer to protect the at least one MEMS sensing element from water jet during dicing.

18. The method of claim 1, wherein the covering units are formed on a continuous substrate with a joining portion, and the step of dicing the MEMS units comprising:

performing a first dicing to remove the joining portion; and

dicing the continuous substrate of the MEMS units.

19. The method of claim 1, wherein the covering units are formed by a print circuit board, wherein each of the units includes interconnection structures and a chamber.

20. The method of claim 1, wherein the covering units are formed by a silicon substrate, wherein each of the covering units includes interconnection structures and a chamber.

21. The method of claim 1, wherein the covering units are formed by ceramics, wherein each of the covering units includes interconnection structures and a chamber.