COMPONENT BONDING USING A CAPILLARY EFFECT

• US 20110167628A1
• Filed: 03/23/2011
• Published: 07/14/2011
• Est. Priority Date: 12/10/2002
• Status: Active Grant

• Current Assignee: Neonode, Inc.
• Original Assignee: Neonode, Inc.
• Inventors: Shain, Joseph, Goertz, Magnus, Eriksson, Thomas, Pettersson, Robert, Sparf, Lars, Jansson, Anders, Karlsson, John, Kvist, Niklas
• Granted Patent: US 8,403,203 B2
• Time in Patent Office: Days
• US Class Current: 29/840
• CPC Class Codes: G06F 2203/04104 Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: G06F 3/0421 by interrupting or reflecting a light beam, e.g. optical touch-screen
• CPC Class Codes: G06F 3/0425 using a single imaging device like a video camera for tracking the absolute position of a single or a plurality of objects with respect to an imaged reference surface, e.g. video camera imaging a display or a projection screen, a table or a wall surface, on which a computer generated image is displayed or projected tracking a projected light spot to determine a position on a display surface G06F3/0386
• CPC Class Codes: G06F 3/0428 by sensing at the edges of the touch surface the interruption of optical paths, e.g. an illumination plane, parallel to the touch surface which may be virtual sensing beam interruptions in a planar beam grid of an optical touch-screen G06F3/0421
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A method of attaching a component to a substrate, including providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component, attaching a first solder pad to the component, inserting the component into the guide cavity, providing a second solder pad, offset from the first solder pad and near the cavity, and inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.

Claims

1. A method of attaching a component to a substrate, comprising:

providing a component guide attached to a substrate, the component guide having a cavity substantially conforming to contours of a portion of a component;

attaching a first solder pad to the component;

inserting the component into the guide cavity;

providing a second solder pad, offset from the first solder pad and near the cavity; and

inserting the component, the component guide and the substrate into an oven heating the solder pads, wherein the component is drawn further into the guide cavity by a capillary effect of the heated solder pads.

2. The method of claim 1 further comprising providing a plurality of notches in the component guide outside of the cavity, for guiding the component into the cavity during the capillary effect.

3. The method of claim 1, wherein the component guide is removably attached to the substrate and is detached for subsequent use when the substrate is removed from the oven.

4. The method of claim 1, wherein the component comprises a light emitter and the component guide comprises a lens for directing light emitted by the emitter.

5. The method of claim 1, wherein the component comprises a light receiver and the component guide comprises a lens for directing light onto the receiver.