DOWNHOLE ELECTRONICS WITH PRESSURE TRANSFER MEDIUM

• US 20110168390A1
• Filed: 09/24/2008
• Published: 07/14/2011
• Est. Priority Date: 09/24/2008
• Status: Active Grant

• Current Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Original Assignee: Halliburton Energy Services Incorporated (Halliburton Company)
• Inventors: Schultz, Roger, Dejesus, Orlando, Kyle, Donald G., Fripp, Michael L.
• Granted Patent: US 9,523,270 B2
• Time in Patent Office: Days
• US Class Current: 166/250.07
• CPC Class Codes: E21B 47/017 Protecting measuring instruments

Abstract

Disclosed embodiments include apparatus and methods for transferring a pressure to downhole electronics with a pressure transfer medium. An embodiment of the apparatus includes a body supporting a moveable pressure transfer member, a pressure transfer medium contained by the body and the moveable pressure transfer member, and an electronic component disposed in the pressure transfer medium, wherein the pressure transfer member is moveable to transfer a pressure to the pressure transfer medium and the electronic component. Another embodiment of the apparatus includes a moveable enclosure and a non-conductive material, wherein the non-conductive material isolates an electronic component from a downhole fluid and the moveable enclosure is operable to transfer a hydrostatic pressure to the non-conductive material and the electronic component. An embodiment of a method includes transferring a downhole hydrostatic pressure to an electronic component via a flexible package and a pressure transfer medium.

Claims

1. A downhole apparatus comprising:

a body supporting a moveable pressure transfer member;

a pressure transfer medium contained by the body and the moveable pressure transfer member; and

an electronic component disposed in the pressure transfer medium;

wherein the pressure transfer member is moveable to transfer a pressure to the pressure transfer medium and the electronic component.

2. The apparatus of claim 1 wherein the body comprises a housing and the moveable pressure transfer member is a floating piston in the housing.

3. The apparatus of claim 2 wherein the body comprises an annular body having a cavity and the moveable pressure transfer member comprises a flexible enclosure containing the electronic component in the cavity.

4. The apparatus of claim 1 wherein the pressure transfer medium comprises a liquid.

5. The apparatus of claim 4 wherein the pressure transfer medium comprise any one or more of a mineral oil, a silicon oil, a hydraulic fluid, a water-based fluid, an alcohol-based fluid, an oil-based fluid, a polyglycol, a triol and a polyol.

6. The apparatus of claim 1 wherein the pressure transfer medium comprises a potting material.

7. The apparatus of claim 1 further including a second electronic component disposed in the pressure transfer medium and isolated from the pressure by a localized pressure housing.

8. The apparatus of claim 1 wherein the electronic component is isolated from a fluid having the pressure.

9. The apparatus of claim 1 wherein the electronic component consists of digital electronics, signal-conditioning electronics, communication electronics, processing electronics, a circuit board, a capacitor, a resistor, an inductor, a transistor, an oscillator, a resonator, a semiconductor chip, a processor, a memory chip, a power supply, a primary battery or a secondary battery.

10. The apparatus of claim 1 wherein the pressure is higher than a vapor pressure of an outgas material in the electronic component.

11. The apparatus of claim 1 wherein the body is an oilfield tubular.

12. The apparatus of claim 1 wherein the electronic component is operable for downhole energy production.

13. The apparatus of claim 1 wherein the electronic component is operable at greater than 100°

C.

14. A downhole apparatus comprising:

a body disposed in a downhole fluid with a hydrostatic pressure;

a moveable enclosure coupled to the body; and

a non-conductive material coupled to the moveable enclosure, the non-conductive material isolating an electronic component from the downhole fluid;

wherein the moveable enclosure is operable to transfer the hydrostatic pressure to the non-conductive material and the electronic component.

15. The apparatus of claim 14 further including a localized pressure housing disposed in the non-conductive material isolating a second electronic component from the hydrostatic pressure.

16. The apparatus of claim 14 wherein the non-conductive material transfers heat away from the electronic component.

17. The apparatus of claim 16 wherein the non-conductive material is circulated.

18. The apparatus of claim 14 wherein the body, the moveable enclosure, the non-conductive material and the electronic component have a neutral density in the hydrostatic pressure.

19. A downhole apparatus comprising:

a body disposed in a downhole fluid with a hydrostatic pressure;

a moveable enclosure coupled to the body, the moveable enclosure containing a heat transfer fluid that is pressurized by the hydrostatic pressure;

an electronic component thermally coupled to the heat transfer fluid; and

a pump circulating the heat transfer fluid.

20. The apparatus of claim 19 wherein the electronic component consists of digital electronics, signal-conditioning electronics, communication electronics, processing electronics, a circuit board, a capacitor, a resistor, an inductor, a transistor, an oscillator, a resonator, a semiconductor chip, a processor, a memory chip, a power supply, a primary battery or a secondary battery.

21. A method for pressurizing a downhole electronic component comprising:

placing the electronic component in a flexible package including a pressure transfer medium coupled to the electronic component;

disposing the package downhole;

exposing the package to a downhole fluid and a hydrostatic pressure;

isolating the electronic component from the downhole fluid; and

transferring the hydrostatic pressure to the electronic component via the flexible package and the pressure transfer medium.

22. The method of claim 21 further comprising:

disposing a pressure housing around a second electronic component in the package; and

isolating the hydrostatic pressure from the second electronic component.

23. The method of claim 21 further comprising:

circulating the pressure transfer medium around the electronic component; and

transferring heat away from the electronic component.

24. The method of claim 21 wherein the electronic component consists of digital electronics, signal-conditioning electronics, communication electronics, processing electronics, a circuit board, a capacitor, a resistor, an inductor, a transistor, an oscillator, a resonator, a semiconductor chip, a processor, a memory chip, a power supply, a primary battery or a secondary battery.

25. The method of claim 21 further comprising:

preventing outgassing of the electronic component.