MOLDED CHIP FABRICATION METHOD AND APPARATUS
First Claim
1. A light emitting diode (LED), comprising:
- a plurality of semiconductor layers comprising an active region between two oppositely doped layers;
positive and negative contacts accessible from one surface of said semiconductor layers, said active region emitting light in response to an electrical signal applied to said contacts; and
conformal coat of matrix material covering surfaces of said semiconductor layers, with at least a portion of said contacts being uncovered by said matrix material.
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0 Petitions
Accused Products
Abstract
A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.
101 Citations
26 Claims
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1. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers comprising an active region between two oppositely doped layers; positive and negative contacts accessible from one surface of said semiconductor layers, said active region emitting light in response to an electrical signal applied to said contacts; and conformal coat of matrix material covering surfaces of said semiconductor layers, with at least a portion of said contacts being uncovered by said matrix material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 21, 22)
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12. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers arranged in a lateral geometry; positive and negative terminals accessible from one side of said semiconductor layers, said semiconductor layers emitting light in response to an electrical signal applied to said terminals; and a conformal coat of conversion material covering surfaces of said semiconductor layers, said conversion material converting at least some of said semiconductor layer light. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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23. A light emitting diode (LED), comprising:
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semiconductor layers with shaped side surfaces; contacts on said semiconductor layers and accessible from one surface of said semiconductor layers; a conversion material arranged as a conformal coat on said semiconductor layers. - View Dependent Claims (24, 25, 26)
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Specification