Method for manufacturing a component, method for manufacturing a component system, component, and component system

• US 20110169107A1
• Filed: 06/09/2009
• Published: 07/14/2011
• Est. Priority Date: 07/18/2008
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Illing, Matthias, Benzel, Hubert, Armbruster, Simon, Pinter, Stefan, Haag, Frieder, Kramer, Torsten
• Application Number:
  US13/054,435
• Publication Number:
  US 20110169107A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/093 Conductive package seal
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 99/008 separating the processed structure from a mother substrate

Abstract

A process for manufacturing a component is described. In a first manufacturing step a base structure having a substrate, a diaphragm, and a cavern region is provided. The diaphragm is oriented substantially parallel to a main plane of extension of the substrate. The cavern region is situated between the substrate and the diaphragm, and has an access opening. In a second manufacturing step, a first conductive layer is provided at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension.

Claims

1-15. -15. (canceled)

16. A method for manufacturing a component, the method comprising:

(a) providing a base structure including a substrate, a diaphragm, and a cavern region, wherein the diaphragm is oriented substantially parallel to a main plane of extension of the substrate, the cavern region is situated between the substrate and the diaphragm, and the cavern region has an access opening;

(b) providing a first conductive layer at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension; and

(c) separating the diaphragm from the substrate.

17. The method of claim 16, wherein the first conductive layer is also provided on a first side of the diaphragm facing away from the substrate perpendicularly to the main plane of extension, and wherein the first conductive layer on the first side is partially connected in an electrically conductive manner to the first conductive layer on the second side.

18. The method of claim 16, wherein the cavern region is provided with support structures for supporting the diaphragm, and wherein the first conductive layer is applied at least partially to the support structures.

19. The method of claim 16, wherein at least one of the following is performed:

(i) in a first substep of step (a), producing at least one of a microelectronic circuit and a micromechanical structure in at least one of the diaphragm and on a first side of the diaphragm facing away from the substrate, and (ii) in a second substep of step (a), etching the access opening into the cavern region.

20. The method of claim 16, further comprising:

providing a first insulating layer on at least one of the diaphragm, the cavern region, and the support structures, wherein the providing of the first insulating layer is carried out before performing step (b).

21. The method of claim 16, wherein in step (b), the first conductive layer is structured by deposition using shadow masks, with the aid of spray coating, by performing the following:

in a first substep of step (b), applying a photoresist to the first conductive layer, in a second substep of step (b), exposing the photoresist, in a third substep of step (b), developing the photoresist, and in a fourth substep of step (b), etching the photoresist of the first conductive layer.

22. The method of claim 16, further comprising:

(d) subsequent to step (b), providing a second conductive layer, which is a galvanic layer, on the first conductive layer.

23. The method of claim 16, wherein in step (a), a wafer composite (300) having a substrate, a plurality of cavern regions, and a plurality of diaphragms are provided, and wherein in step (c), at least one diaphragm is removed from the wafer composite for separating the diaphragm.

30. The method of claim 16, wherein the diaphragm is torn away from the substrate, and the support structures are caused to break by vibration excitation of at least one of the substrate, the diaphragm, and the support structures.

24. A method for manufacturing a component system having a component, the method comprising:

(i) making a component by performing the following;

(a) providing a base structure including a substrate, a diaphragm, and a cavern region, wherein the diaphragm is oriented substantially parallel to a main plane of extension of the substrate, the cavern region is situated between the substrate and the diaphragm, and the cavern region has an access opening;

(b) providing a first conductive layer at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension; and

(c) separating the diaphragm from the substrate;

(ii) subsequent to step (c), providing the component on at least one of a further component and on a carrier element, in particular on at least one of a printed circuit board and in a housing, and being at least one of soldered, bonded, and glued, the at least one of the microelectronic circuit and the micromechanical structure is electrically contacted with the aid of at least one of the first conductive layer and the second conductive layer.

25. A component, comprising:

a component having a diaphragm, wherein a first conductive layer is situated in a cavern region and in particular on a second side of the diaphragm;

wherein the component is made by performing the following;

(a) providing a base structure including a substrate, a diaphragm, and the cavern region, wherein the diaphragm is oriented substantially parallel to a main plane of extension of the substrate, the cavern region is situated between the substrate and the diaphragm, and the cavern region has an access opening;

(b) providing the first conductive layer at least partially in the cavern region, in particular on the second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension; and

(c) separating the diaphragm from the substrate.

26. The component of claim 25, wherein the first conductive layer is also situated on the first side, the first conductive layer including at least one electrically conductive contact between the first side and the cavern region, and in particular between the first side and the second side.

27. The component of claim 25, wherein the diaphragm has at least one of a microelectronic circuit and a micromechanical structure which is contactable from at least one of the cavern region and from the second side, in particular with the aid of the at least one electrically conductive contact.

28. A component system, comprising:

a component;

a further component, wherein the component is situated on at least one of the further component and on a carrier element, and in particular is at least one of soldered, glued, and bonded, and wherein the carrier element includes at least one of a printed circuit board and a housing;

wherein the component is made by performing the following;

(a) providing a base structure including a substrate, a diaphragm, and a cavern region, wherein the diaphragm is oriented substantially parallel to a main plane of extension of the substrate, the cavern region is situated between the substrate and the diaphragm, and the cavern region has an access opening;

(b) providing a first conductive layer at least partially in the cavern region, in particular on a second side of the diaphragm facing the substrate, perpendicularly to the main plane of extension; and

(c) separating the diaphragm from the substrate.

14. The component system of claim 28, wherein the component is situated essentially congruently on the further component, in particular perpendicularly to the main plane of extension, and a further electrically conductive contact of the further component is connected to the corresponding electrically conductive contact of the component in an electrically conductive manner.