Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

• US 20110169115A1
• Filed: 01/12/2011
• Published: 07/14/2011
• Est. Priority Date: 01/14/2010
• Status: Abandoned Application

• Current Assignee: RFMarq, Inc.
• Original Assignee: RFMarq, Inc.
• Inventors: Lin, Chang-Ming
• Application Number:
  US13/005,336
• Publication Number:
  US 20110169115A1
• Time in Patent Office: Days
• US Class Current: 257/428
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 23/053 : the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A semiconductor package includes a package body with a cavity housing a first integrated circuit die. A wireless tag including a wireless element and an antenna is embedded in the semiconductor package. In one embodiment, the antenna is embedded in the package body of the semiconductor package. In another embodiment, the antenna is formed on or in the first integrated circuit die housed in the semiconductor package. According to another aspect of the present invention, the semiconductor package may be mounted on a printed circuit board and a second antenna is formed on the printed circuit board in electrical connection to the antenna embedded in the semiconductor package.

Claims

1. A semiconductor package, comprising:

a package body including a cavity;

a first integrated circuit die housed in the cavity and electrically connected to leads of the semiconductor package;

a wireless element including a wireless transceiver and a memory circuit both formed in a second integrated circuit die, the wireless element being housed in the semiconductor package; and

an antenna embedded in the package body and electrically connected to the wireless element,

wherein the wireless transceiver and the antenna operate in conjunction to enable the information stored in the memory circuit to be accessed through wireless communication.

2. The semiconductor package of claim 1, wherein the package body comprises a multi-layer interconnect structure including interleaving metal films and dielectric films;

and the antenna is formed as part of the multi-layer interconnect structure using one or more of the metal films.

3. The semiconductor package of claim 1, wherein the wireless element is affixed to a top surface of the first integrated circuit die.

4. The semiconductor package of claim 3, wherein the wireless element is affixed to the top surface of the first integrated circuit die using a die attach and the wireless element comprises bonding pads formed on a top surface of the wireless element, the bonding pads being electrically connected to terminals of the antenna using bond wires.

5. The semiconductor package of claim 3, wherein the wireless element is affixed to the top surface of the first integrated circuit die using flip-chip attachment and the wireless element is electrically connected to terminals of the antenna using bond wires and metal traces formed on the top surface of the first integrated circuit die.

6. The semiconductor package of claim 1, wherein the wireless element is affixed to an inner surface of the package body.

7. The semiconductor package of claim 6, wherein the wireless element is affixed to the inner surface of the package body using a die attach and the wireless element comprises bonding pads formed on a top surface of the wireless element, the bonding pads being electrically connected to terminals of the antenna using bond wires.

8. The semiconductor package of claim 6, wherein the wireless element is affixed to the inner surface of the package body using flip-chip attachment and the wireless element is electrically connected to terminals of the antenna through solder joints connected to conductive pads or bonding fingers of the package body.

9. The wireless tag of claim 1, wherein the wireless transceiver comprises a radio frequency (RF) transceiver.

18. The semiconductor package of claim 6, wherein the wireless element is affixed to the inner surface of the package body using flip-chip attachment and the wireless element is electrically connected to terminals of the second antenna through conductive pads formed on the top surface of the first integrated circuit die.

10. A semiconductor package, comprising:

a package body including a cavity;

a first integrated circuit die housed in the cavity and electrically connected to leads of the semiconductor package;

a wireless element including a wireless transceiver and a memory circuit both formed in a second integrated circuit die, the wireless element being housed in the semiconductor package; and

an antenna formed on or in the first integrated circuit die and electrically connected to the wireless element,

wherein the wireless transceiver and the antenna operate in conjunction to enable the information stored in the memory circuit to be accessed through wireless communication.

11. The semiconductor package of claim 10, wherein the antenna is formed as metal traces on a passivation layer of the first integrated circuit die.

12. The semiconductor package of claim 10, wherein the antenna is formed using one or more of the metal layers of the first integrated circuit die.

13. The semiconductor package of claim 10, wherein the wireless element is affixed to the top surface of the first integrated circuit die using a die attach and the wireless element comprises bonding pads formed on a top surface of the wireless element, the bonding pads being electrically connected to terminals of the antenna using bond wires.

14. The semiconductor package of claim 10, wherein the wireless element is affixed to the top surface of the first integrated circuit die using flip-chip attachment and the wireless element is electrically connected to terminals of the antenna using solder joints and metal traces formed on the top surface of the first integrated circuit die.

15. The semiconductor package of claim 10, further comprising a second antenna embedded in the package body and electrically connected to the antenna formed on or in the first integrated circuit die.

16. The semiconductor package of claim 15, wherein the wireless element is affixed to an inner surface of the package body.

17. The semiconductor package of claim 16, wherein the wireless element is affixed to the inner surface of the package body using a die attach and the wireless element comprises bonding pads formed on a top surface of the wireless element, the bonding pads being electrically connected to terminals of the second antenna using bond wires.

19. A printed circuit board, comprising:

one or more semiconductor packages mounted thereon, each semiconductor package housing an integrated circuit die;

a first semiconductor package comprising;

a first integrated circuit die electrically connected to leads of the semiconductor package;

a wireless element including a wireless transceiver and a memory circuit both formed on a second integrated circuit die, the wireless element being housed in the semiconductor package; and

a first antenna embedded in the package body and electrically connected to the wireless element;

a second antenna formed in the printed circuit board and being electrically connected to the first antenna,

wherein the wireless transceiver and the first and second antennas operate in conjunction to enable the information stored in the memory circuit to be accessed through wireless communication.

20. The printed circuit board of claim 19, wherein the second antenna is formed in one or more metal planes of the printed circuit board.

21. The printed circuit board of claim 19, wherein terminals of the second antenna is electrically connected to a first set of leads of the first semiconductor package, the first set of leads being electrically connected to terminals of the first antenna embedded in the package body of the semiconductor package.