Dual Interconnection in Stacked Memory and Controller Module

• US 20110169171A1
• Filed: 03/18/2011
• Published: 07/14/2011
• Est. Priority Date: 04/28/2009
• Status: Abandoned Application

• Current Assignee: Wafer-Level Packaging Portfolio LLC
• Original Assignee: Wafer-Level Packaging Portfolio LLC
• Inventors: Marcoux, Phil P.
• Application Number:
  US13/051,917
• Publication Number:
  US 20110169171A1
• Time in Patent Office: Days
• US Class Current: 257/774
• CPC Class Codes: H01L 2224/02372 connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05009 Bonding area integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/13009 Bump connector integrally formed with a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/41 : of a plurality of strap connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A chip package transmitting slow speed signals via edge connectors and high speed signals by means of through-silicon-vias. The edge connectors are formed in recesses formed in the sidewalls of the package.

Claims

1. Apparatus comprising:

an integrated circuit die having a topside and a bottom side;

an integrated circuit formed in the topside of said die;

a plurality of topside contact terminals;

said integrated circuit having two groups of signals, a first group consisting of slow speed signals and a second group consisting of high-speed signals;

the integrated circuit having means for connecting the slow speed signals to a first group of topside contact terminals;

the integrated circuit having means for connecting the high speed signals to a second group of topside contact terminals;

a plurality of edge electrical connectors connected to said first group of topside contact terminals;

a plurality of through-hole vias connected to said second group of topside contact terminals; and

a plurality of via electrical connectors connected to said second group of topside contact terminals through said through-hole vias;

whereby the high-speed signals are connected to the via electrical connectors and the slow speed signals are connected to the edge electrical connectors.

2. Apparatus according to claim 1, wherein said slow speed signals are selected from the group consisting of power, ground, and chip select.

3. Apparatus according to claim 1, further including a plurality of contacts formed on the bottom side of the die wherein said via electrical connectors are connected to a least a subset of said bottom side contacts.

4. Apparatus according to claim 1, further including a plurality of contacts formed on the bottom side of the die wherein said edge electrical connectors are connected to a least a subset of said bottom side contacts.

5. Apparatus according to claim 1, wherein said die has one or more recesses formed on the side of said die and at least one of said edge connectors is formed in said at least one recess.

6. Apparatus according to claim 5, wherein the at least one of said edge connectors formed in said at least one recess is connected to supply power to said integrated circuit.

7-29. -29. (canceled)