SIGNAL TRANSMITTING/RECEIVING CIRCUIT INCLUDING AN IMPEDANCE MATCHING CIRCUIT

• US 20110169587A1
• Filed: 12/28/2010
• Published: 07/14/2011
• Est. Priority Date: 01/14/2010
• Status: Active Grant

• Current Assignee: Realtek Semiconductor Corp.
• Original Assignee: Realtek Semiconductor Corp.
• Inventors: Wang, Po-Chih, Chang, Chia-Jun
• Granted Patent: US 8,472,894 B2
• Time in Patent Office: Days
• US Class Current: 333/124
• CPC Class Codes: H03H 2007/386 Multiple band impedance matching
• CPC Class Codes: H04B 1/52 Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa

Abstract

A signal transmitting/receiving circuit includes a transmitter, a receiver, a balun and an impedance matching circuit. The transmitter is utilized for transmitting an output signal. The receiver is utilized for receiving an input signal. The balun includes a first input terminal, a second input terminal and an output terminal. The impedance matching circuit, which is coupled between the transmitter, the receiver, and the balun, provides transmitting impedance when the transmitter transmits the output signal such that an output signal may be output at an output terminal of the balun via a transmitting path. Also, the impedance matching circuit provides transmitting impedance when the receiver receives the input signal such that the input signal may be transmitted from the output terminal of the balun to the receiver via a receiving path.

Claims

1. A signal transmitting/receiving circuit, comprising:

a transmitter, for transmitting an output signal;

a receiver, for receiving an input signal;

a balun, having a first input terminal, a second input terminal and an output terminal; and

an impedance matching circuit, coupled between the transmitter, the receiver and the balun, for providing a transmitting impedance when the transmitter transmits the output signal such that the output signal is output at an output terminal of the balun via a transmitting path, and providing a receiving impedance when the receiver receives the input signal such that the input signal is transmitted from the output terminal of the balun to the receiver via a receiving path.

2. The signal transmitting/receiving circuit of claim 1, wherein the impedance matching circuit comprises a plurality of capacitors and a plurality of bonding wires.

3. The signal transmitting/receiving circuit of claim 2, wherein the impedance matching circuit further comprises a plurality of bonding pads, and the capacitors are coupled between the bonding pads.

4. The signal transmitting/receiving circuit of claim 1, wherein the impedance matching circuit further comprises at least one switch component coupled between the receiving path and a ground potential.

5. The signal transmitting/receiving circuit of claim 1, further comprising an inductor, coupled between the first input terminal and the second input terminal of the balun.

6. The signal transmitting/receiving circuit of claim 1, further comprising:

an antenna, coupled to the output terminal of the balun.

7. The signal transmitting/receiving circuit of claim 1, wherein the transmitter, the receiver and the balun are disposed in a same integrated circuit (IC).

8. The signal transmitting/receiving circuit of claim 4, wherein the switch component is switched on when the transmitter transmits the output signal, and is switched off when the receiver receives the input signal.

9. The signal transmitting/receiving circuit of claim 4, wherein the switch component is coupled between the input terminal of the receiver and the ground potential.