STRUCTURE, ANTENNA, COMMUNICATION DEVICE AND ELECTRONIC COMPONENT

• US 20110170267A1
• Filed: 09/11/2009
• Published: 07/14/2011
• Est. Priority Date: 09/11/2008
• Status: Active Grant

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Ando, Noriaki
• Granted Patent: US 9,570,814 B2
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0086 said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
• CPC Class Codes: H01Q 15/14 Reflecting surfaces; Equivalent structures electromagnetic shields H01Q1/526
• CPC Class Codes: H01Q 21/0031 Parallel-plate fed arrays; Lens-fed arrays multibeam arrays H01Q25/008
• CPC Class Codes: H01Q 21/061 Two dimensional planar arrays
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence

Abstract

A structure 110 includes a first conductor pattern 121, a second conductor pattern 111, a plurality of first openings 104 and a plurality of lines 106. The first conductor pattern 121 has a sheet shape, for example. The second conductor pattern 111 has a sheet shape, for example, and is opposite to the first conductor pattern 121 at least in part. The plurality of first openings 104 are provided in the first conductor pattern 121. The lines 106 are provided in the first openings 104, respectively, and one end thereof is connected to the first conductor pattern 121. Unit cells 107 each containing the first opening 104 and the line 106 are repeatedly arranged.

Claims

1. A structure comprising:

a first conductor;

a second conductor opposite to said first conductor at least in part;

a plurality of first openings provided in said first conductor; and

a plurality of interconnects which are provided in said plurality of first openings and whose ends are connected to said first conductor,

wherein unit cells each containing said first opening and said interconnect are repeatedly arranged.

2. The structure according to claim 1,

wherein the other end of said interconnect is an open end.

3. The structure according to claim 2,

wherein said plurality of interconnects, said plurality of first openings and said first conductor are integrally formed.

4. The structure according to claim 2,

wherein said interconnects and parts opposite to said interconnects in said second conductor form a transmission line.

5. The structure according to claim 4,

wherein said transmission line is a microstrip line.

6. The structure according to claim 2,

wherein lengths of said plurality of interconnects are equal to each other.

7. The structure according to claim 2,

wherein said ends of said plurality of interconnects are periodically arranged.

8. The structure according to claim 2,

wherein said plurality of unit cells each comprise a branch interconnect positioned inside said first opening and branched from said interconnect.

9. The structure according to claim 1,

wherein said plurality of unit cells each comprise an island-shaped third conductor which is provided in said first opening to be separated from said first conductor and is connected to the other end of said interconnect.

10. The structure according to claim 9,

wherein said first conductor, said plurality of first openings, said plurality of interconnects and said plurality of third conductors are integrally formed.

11. The structure according to claim 9,

wherein said unit cells have a plurality of said third conductors in said first opening and have said interconnects per said plurality of third conductors.

12. The structure according to claim 9, comprising

a plurality of second openings which are provided in said second conductor and overlap said plurality of interconnects in a plan view.

13. The structure according to claim 1,

wherein said interconnect extends linearly or in a polygonal line.

14. The structure according to claim 1,

wherein said interconnect extends to form a meander, loop or spiral.

16. The structure according to claim 1,

wherein said plurality of unit cells are arranged in two dimensions.

17. The structure according to claim 1,

wherein said plurality of unit cells are arranged in one dimension.

18. The structure according to claim 1,

wherein said plurality of unit cells have the same configuration and the same orientation.

19. The structure according to claim 1,

wherein said plurality of openings are each polygonal.

15. A structure comprising:

a first conductor;

a second conductor opposite to said first conductor at least in part;

a plurality of first openings provided in said first conductor;

a plurality of island-shaped third conductors provided in said plurality of first openings to be separated from said first conductor, respectively; and

chip inductors provided in said plurality of third conductors to connect said third conductors to said first conductor,

wherein unit cells each having said first opening, said third conductor and said chip inductor are repeatedly arranged.

33. The structure according to claim 15,

wherein said plurality of unit cells are arranged in two dimensions.

34. The structure according to claim 15,

wherein said plurality of unit cells are arranged in one dimension.

35. The structure according to claim 15,

wherein said plurality of unit cells have the same configuration and the same orientation.

36. The structure according to claim 15,

wherein said plurality of openings are each polygonal.

20. An antenna comprising:

an antenna element; and

a reflective plate provided opposite to said antenna element,

wherein said reflective plate has a structure,

said structure comprising;

a first conductor;

a second conductor opposite to said first conductor at least in part;

a plurality of first openings provided in said first conductor; and

a plurality of interconnects which are provided in said plurality of first openings and whose ends are connected to said first conductor, respectively,

wherein unit cells each containing said first opening and said interconnect are repeatedly arranged.

21. The antenna according to claim 20,

wherein said structure is used as an EBG (Electromagnetic Band Gap) structure, and

a frequency at which said antenna makes communication is contained in a band gap of said EBG structure.

22. The antenna according to claim 20,

wherein said antenna is a inverted-L antenna, and

an antenna element is arranged opposite to said first conductor.

23. A communication device comprising:

an antenna according to claim 20; and

a communication processing unit connected to said antenna.

24. An electronic component comprising:

a power supply layer to which power is supplied;

a ground layer to which a ground is supplied;

a first conductor provided in one of said power supply layer and said ground layer;

a second conductor provided in the other of said power supply layer and said ground layer and opposite to said first conductor at least in part;

a plurality of first openings provided in said first conductor; and

a plurality of interconnects which are provided in said plurality of first openings and whose ends are connected to said first conductor, respectively,

wherein unit cells each containing said first opening and said interconnect are repeatedly arranged.

25. The electronic component according to claim 24, further comprising a signal line formed in a layer different from said power supply layer and said ground layer.

26. The electronic component according to claim 24, further comprising a signal line formed in at least one of said power supply layer and said ground layer.

27. The electronic component according to claim 24,

wherein said electronic component is a circuit board.

28. The electronic component according to claim 27, comprising:

a first area on which a first semiconductor package is mounted; and

a second area on which a second semiconductor package is mounted,

wherein a third area in which said unit cells are repeatedly arranged is present between said first area and said second area.

29. The electronic component according to claim 28, further comprising said first semiconductor package and said second semiconductor package.

30. The electronic component according to claim 24,

wherein said electronic component is an interposer.

31. The electronic component according to claim 30, further comprising a first area on which semiconductor chips are entirely mounted,

wherein said unit cells are repeatedly arranged at least in said first area.

32. The electronic component according to claim 31, further comprising said first conductor chip.