ELECTROMAGNETIC BAND GAP STRUCTURE, ELEMENT, SUBSTRATE, MODULE, AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC BAND GAP STRUCTURE, AND PRODUCTION METHODS THEREOF

• US 20110170268A1
• Filed: 10/02/2009
• Published: 07/14/2011
• Est. Priority Date: 10/02/2008
• Status: Abandoned Application

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Ando, Noriaki, Tsukagoshi, Tsuneo, Takemura, Koichi
• Application Number:
  US13/119,247
• Publication Number:
  US 20110170268A1
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01P 1/2005 Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/008 said selective devices having Sievenpipers' mushroom elements
• CPC Class Codes: H05K 1/0236 : Electromagnetic band-gap structures
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 2201/09309 : Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09663 : Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 3/4644 : by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

To provide a small-sized and thin electromagnetic band gap structure which can be surface-mounted or built in a substrate. An electromagnetic band gap structure according to an aspect of the present invention includes: an insulating substrate; a plurality of conductor pieces regularly arranged on the insulating substrate; a dielectric layer formed so as to fill a space between adjacent ones of the conductor pieces; an interlayer insulating layer formed on the dielectric layer; and a conductor plane which is formed on the interlayer insulating layer and is connected to each of the conductor pieces with a conductor penetrating through the interlayer insulating layer.

Claims

1. An electromagnetic band gap structure comprising:

an insulating substrate;

a plurality of conductor pieces regularly arranged on the insulating substrate;

a dielectric layer formed so as to fill a space between adjacent ones of the conductor pieces;

an interlayer insulating layer formed on the dielectric layer; and

a conductor plane that is formed on the interlayer insulating layer and is connected to each of the conductor pieces with a conductor penetrating through the interlayer insulating layer.

2. The electromagnetic band gap structure according to claim 1, wherein

the plurality of conductor pieces include a first conductor piece formed on the insulating substrate, and a second conductor piece formed above the first conductor piece, and

the dielectric layer is formed between the first conductor piece and the second conductor piece.

3. The electromagnetic band gap structure according to claim 2, wherein an interval between the first conductor piece and the second conductor piece is 1 μ

m or less.

4. The electromagnetic band gap structure according to claim 1, wherein the dielectric layer is stacked only in a space between adjacent ones of the conductor pieces in the same plane and in a neighboring region thereof.

5. The electromagnetic band gap structure according to claim 1, wherein the insulating substrate is made of a material selected from the group consisting of glass, alumina, sapphire, and quartz.

6. The electromagnetic band gap structure according to claim 1, wherein

the insulating substrate comprises the dielectric layer, and

the plurality of conductor pieces are buried in the insulating substrate.

7. The electromagnetic band gap structure according to claim 1, wherein each of the conductor pieces has a stacked structure of an intermediate layer which is formed of at least one layer selected from the group consisting of Ti, Ta, Cr, and nitrides of these elements and which is formed from a side of the insulating substrate, and at least one layer which is selected from the group consisting of Pt, Pd, Ru, and Ir and which is formed on an upper layer side of the intermediate layer.

8. The electromagnetic band gap structure according to claim 1, wherein the dielectric layer is mainly composed of at least one of oxides of Mg, Al, Si, Ti, Ta, Hf, and Zr.

9. The electromagnetic band gap structure according to claim 1, wherein the dielectric layer is mainly composed of a material comprising a composite oxide represented by a chemical formula ABO₃ or A₂B₂O₇ as a basic structure.

10. A filter element comprising:

an electromagnetic band gap structure according to claim 1; and

an external connection terminal formed on a part of the conductor plane.

11. An antenna element comprising:

an electromagnetic band gap structure according to claim 1; and

a feeder connected to a part of the conductor plane.

12. A substrate with a built-in element comprising:

a printed wiring board; and

at least one of an electromagnetic band gap structure according to claim 1, the electromagnetic band gap structure being buried in the printed wiring board, a filter element according to claim 10, and an antenna element according to claim 11.

13. A multi-chip module comprising:

a substrate with a built-in element according to claim 12; and

two or more semiconductor devices mounted on the substrate with a built-in element.

14. A semiconductor device comprising:

an electromagnetic band gap structure according to claim 1; and

one or more semiconductor elements mounted in the electromagnetic band gap structure.

15. A multi-chip module comprising:

a semiconductor device according to claim 14;

two or more semiconductor elements mounted on the semiconductor device; and

a terminal that is formed on the semiconductor element and is connected to another printed wiring board.

16. A production method of an electromagnetic band gap structure, comprising:

forming a plurality of conductor pieces regularly on an insulating substrate;

forming a dielectric layer so as to fill a space between adjacent ones of the conductor pieces;

forming an interlayer insulating layer on the dielectric layer; and

forming a conductor plane on the interlayer insulating layer, the conductor plane being connected to each of the conductor pieces.

17. The production method of an electromagnetic band gap substrate according to claim 16, wherein after the formation of the dielectric layer, a portion of the dielectric layer other than portions formed in a space between adjacent ones of the conductor pieces in the same plane and in a neighboring region thereof is removed.

18. The production method of an electromagnetic band gap structure according to claim 16, wherein, in the step of forming the dielectric layer, the dielectric layer is stacked with a portion of the dielectric layer other than portions formed in a space between adjacent ones of the conductor pieces in the same plane and in a neighboring region thereof as a mask.

19. The production method of an electromagnetic band gap structure according to claim 16, comprising:

forming, as the plurality of conductor pieces, a first conductor piece and a second conductor piece above the first conductor piece; and

forming the dielectric layer between the first conductor piece and the second conductor piece.

20. The production method of an electromagnetic band gap structure according to claim 19, wherein the dielectric layer has a thickness of 1 μ

m or less.

21. The production method of an electromagnetic band gap structure according to claim 16, wherein

the insulating substrate comprises the dielectric layer, and

the plurality of conductor pieces are buried in the insulating substrate to thereby form the dielectric layer between adjacent ones of the conductor pieces.

22. The production method of an electromagnetic band gap structure according to claim 16, wherein the step of forming the conductor pieces comprises:

forming an intermediate layer which is formed of at least one layer selected from the group consisting of Ti, Ta, Cr, and nitrides of these elements and which is formed from a side of the insulating substrate; and

stacking at least one layer selected from the group consisting of Pt, Pd, Ru;

and Ir on an upper layer side of the intermediate layer.

23. The production method of an electromagnetic band gap structure according to claim 16, wherein the dielectric layer is mainly composed of at least one of oxides and nitrides of Mg, Al, Si, Ti, Ta, Hf, and Zr.

24. The production method of an electromagnetic band gap structure according to claim 16, wherein the dielectric layer is mainly composed of a material comprising a composite oxide represented by a chemical formula ABO₃ or A₂B₂O₇ as a basic structure.

25. The electromagnetic band gap structure according to claim 16, wherein the dielectric layer is deposited by a method selected from the group consisting of a sputtering method, a CVD method, a sol-gel method, and an aerosol deposition method.

26. The production method of an electromagnetic band gap structure according to claim 16, wherein the insulating substrate is made of a material selected from the group consisting of glass, alumina, sapphire, and quartz.

27. The production method of an electromagnetic band gap structure according to claim 16, wherein the insulating substrate is thinned after formation of a stacked structure of the plurality of conductor pieces, the dielectric layer, the interlayer insulating layer, and the conductor plane.

28. The production method of an electromagnetic band gap structure according to claim 16, wherein

the insulating substrate is a structure in which a polyimide resin is applied onto a surface of a plate-like base material selected from the group consisting of glass, alumina, sapphire, quartz, silicon, GaAs, stainless steel, Cu, Ni, W, and Mo, and

the plate-like base material is removed after formation of a stacked structure of the plurality of conductor pieces, the dielectric layer, the interlayer insulating layer, and the conductor plane.

29. A production method of a substrate with a built-in element, a multi-chip module, or a semiconductor device, comprising:

forming an electromagnetic band gap structure on an insulating substrate by a production method according to claim 16;

thinning or removing the insulating substrate so that a structure having the electromagnetic band gap structure formed on the insulating substrate has an overall thickness of 300 μ

m or less; and

burying the thinned structure in a printed wiring board.