THREE-DIMENSIONAL SILICONE-RUBBER BONDED OBJECT
First Claim
1. A silicone-rubber bonded object comprising;
- a three-dimensional silicone rubber elastic substrate having hydroxyl groups on a surface thereof laminated with an adherend substrate having hydroxyl groups on a surface thereof,and the substrates being connected to each other through covalent bonds between the hydroxyl groups of both.
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Accused Products
Abstract
A simple silicone-rubber bonded object is provided in which non-flowable substrates, i.e., a three-dimensional silicone rubber elastic substrate molded beforehand and an adherend substrate, were able to be tenaciously bonded to each other without using a flowable curable adhesive or pressure-sensitive adhesive and which is inexpensive and has high productivity. The silicone-rubber bonded object comprises a three-dimensional silicone rubber elastic substrate having hydroxyl groups on the surface and an adherend substrate having hydroxyl groups on the surface, the substrates having been laminated to each other through covalent bonding between the hydroxyl groups of both. The elastic substrate and/or the adherend substrate has undergone corona discharge treatment and/or plasma treatment, whereby the hydroxyl groups have been formed on the surface thereof.
65 Citations
13 Claims
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1. A silicone-rubber bonded object comprising;
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a three-dimensional silicone rubber elastic substrate having hydroxyl groups on a surface thereof laminated with an adherend substrate having hydroxyl groups on a surface thereof, and the substrates being connected to each other through covalent bonds between the hydroxyl groups of both. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing a silicone-rubber bonded object comprising;
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a lamination step for laminating a three-dimensional silicone rubber elastic substrate having hydroxyl groups on a surface thereof with an adherend substrate having hydroxyl groups on a surface thereof; and a bond step for bonding the substrates to each other through covalent bonds formed between the hydroxyl groups of both at 0 to 200°
C. under a load treatment or a reduced pressure treatment. - View Dependent Claims (12, 13)
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Specification