METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND AN INVERTED CAVITY IN THE BUMP
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Abstract
A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
155 Claims
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1-85. -85. (canceled)
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86. A method of making a semiconductor chip assembly, comprising:
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providing a bump, a ledge, an adhesive and a conductive layer, wherein the bump is adjacent to and integral with the ledge, extends vertically from the ledge in a first vertical direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer, the ledge extends laterally from the bump in lateral directions orthogonal to the first vertical direction, a cavity in the bump faces in a second vertical direction opposite the first vertical direction and is covered by the bump in the first vertical direction, the adhesive is mounted on the ledge, is sandwiched between the ledge and the conductive layer and is non-solidified, and the conductive layer is mounted on the adhesive;
thenflowing the adhesive in the first vertical direction into a gap located in the aperture between the bump and the conductive layer; solidifying the adhesive;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
thenmounting a semiconductor device on the bump, wherein a heat spreader includes the bump and a base, the bump is adjacent to the base and extends vertically from the base in the first vertical direction, the base includes a portion of the ledge that is adjacent to and integral with and extends laterally from the bump and the semiconductor device extends beyond the bump in the first vertical direction, is located outside the cavity and extends laterally within a periphery of the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105)
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106. A method of making a semiconductor chip assembly, comprising:
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providing a bump and a ledge, wherein the bump is adjacent to and integral with the ledge and extends vertically from the ledge in a first vertical direction, the ledge extends laterally from the bump in lateral directions orthogonal to the first vertical direction and a cavity in the bump faces in a second vertical direction opposite the first vertical direction, is covered by the bump in the first vertical direction and extends across most of the bump in the vertical and lateral directions; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the ledge, including inserting the bump into the opening, wherein the bump and the cavity extend into the opening; mounting the conductive layer on the adhesive, including aligning the bump with the aperture, wherein the adhesive is sandwiched between the ledge and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the ledge and the conductive layer towards one another, thereby moving the bump in the first vertical direction in the aperture and applying pressure to the molten adhesive between the ledge and the conductive layer, wherein the pressure forces the molten adhesive to flow in the first vertical direction into a gap located in the aperture between the bump and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the bump and the ledge to the conductive layer;
thenproviding a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer;
thenmounting a semiconductor device on the bump, wherein a heat spreader includes the bump and a base, the bump is adjacent to the base and extends vertically from the base in the first vertical direction, the base includes a portion of the ledge that is adjacent to and integral with and extends laterally from the bump and the semiconductor device extends beyond the bump in the first vertical direction, is located outside the cavity and extends laterally within a periphery of the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the bump, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119, 120, 121, 122, 123, 124, 125)
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126. A method of making a semiconductor chip assembly, comprising:
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providing a bump, a ledge, an adhesive and a conductive layer, wherein the bump is adjacent to and integral with the ledge, extends vertically from the ledge in a first vertical direction, extends into an opening in the adhesive and is aligned with an aperture in the conductive layer, the ledge extends laterally from the bump in lateral directions orthogonal to the first vertical direction, a cavity in the bump faces in a second vertical direction opposite the first vertical direction, is covered by the bump in the first vertical direction and extends across most of the bump in the vertical and lateral directions, the adhesive is mounted on the base, is sandwiched between the base and the conductive layer and is non-solidified, and the conductive layer is mounted on the adhesive;
thenflowing the adhesive in the first vertical direction into a gap located in the aperture between the bump and the conductive layer; solidifying the adhesive;
thenproviding a conductive trace that includes a pad and a terminal, wherein the pad includes a selected portion of the conductive layer; providing a heat spreader includes the bump, a base and a cap, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction, the base includes a portion of the ledge that is adjacent to and integral with and extends laterally from the bump and the cap is adjacent to the bump, covers the bump in the first vertical direction, extends laterally from the bump and includes a selected portion of the conductive layer;
thenmounting a semiconductor device on the cap, wherein the semiconductor device extends beyond the cap in the first vertical direction, is located outside the cavity and extends laterally within a periphery of the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (127, 128, 129, 130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141, 142, 143, 144, 145)
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146. A method of making a semiconductor chip assembly, comprising:
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providing a bump and a ledge, wherein the bump is adjacent to and integral with the ledge and extends vertically from the ledge in a first vertical direction, the ledge extends laterally from the bump in lateral directions orthogonal to the first vertical direction and a cavity in the bump faces in a second vertical direction opposite the first vertical direction, is covered by the bump in the first vertical direction, extends across most of the bump in the vertical and lateral directions and has an entrance at the ledge; providing an adhesive, wherein an opening extends through the adhesive; providing a conductive layer, wherein an aperture extends through the conductive layer; mounting the adhesive on the ledge, including inserting the bump into the opening, wherein the bump and the cavity extend into the opening; mounting the conductive layer on the adhesive, including aligning the bump with the aperture, wherein the adhesive is sandwiched between the ledge and the conductive layer and is non-solidified;
thenapplying heat to melt the adhesive; moving the ledge and the conductive layer towards one another, thereby moving the bump in the first vertical direction in the aperture and applying pressure to the molten adhesive between the ledge and the conductive layer, wherein the pressure forces the molten adhesive to flow in the first vertical direction into a gap located in the aperture between the bump and the conductive layer; applying heat to solidify the molten adhesive, thereby mechanically attaching the bump and the ledge to the conductive layer;
thenproviding a conductive trace that includes a pad and a terminal, wherein the pad includes a selected portion of the conductive layer; providing a heat spreader includes the bump, a base and a cap, wherein the bump is adjacent to the base and extends vertically from the base in the first vertical direction, the base includes a portion of the ledge that is adjacent to and integral with and extends laterally from the bump and the cap is adjacent to the bump, covers the bump in the first vertical direction, extends laterally from the bump and includes a selected portion of the conductive layer;
thenmounting a semiconductor device on the cap, wherein the semiconductor device extends beyond the cap in the first vertical direction, is located outside the cavity and extends laterally within a periphery of the cavity; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (147, 148, 149, 150, 151, 152, 153, 154, 155)
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Specification