SEMI-AUTOMATED REWORKABILITY EQUIPMENT FOR DE-BONDING A DISPLAY

• US 20110174445A1
• Filed: 11/20/2009
• Published: 07/21/2011
• Est. Priority Date: 11/20/2008
• Status: Abandoned Application

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Dodson, Charles W. JR., Ciliberti, Michael
• Application Number:
  US13/120,467
• Publication Number:
  US 20110174445A1
• Time in Patent Office: Days
• US Class Current: 156/752
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: Y10T 156/19 Delaminating means
• CPC Class Codes: Y10T 156/1911 Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
• CPC Class Codes: Y10T 156/1922 Vibrating delaminating means
• CPC Class Codes: Y10T 156/1967 Cutting delaminating means

Abstract

A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured.

Claims

1. A device for carrying out a method for reworking a bonded display having a surface and a substrate adhesively bonded with a cured adhesive layer to the surface of the display, the device comprising:

a) means for advancing the bonded display, from an edge or a corner of the display to an opposing edge or an opposing corner of the display, through a line in a manner such that the cured adhesive layer contacts the line resulting in break-up of the adhesive layer such that the substrate is no longer bonded to the display; and

b) means for removing the cured adhesive layer from the display to afford a de-bonded display and the substrate.

2. The device of claim 1, wherein the line is a moving line.

3. The device of claim 1, wherein the line is within 10 degrees of being orthogonal to the direction that the cured adhesive layer is being advanced.

4. The device of claim 1, wherein the line is selected from the group consisting of a fiber, a rope, a thread, a wire, a sheet, a blade and a cutting edge.

5. The device of claim 1, wherein the line comprises a braided material.

6. The device of claim 1, wherein the line comprises a non-woven material.

7. The device of claim 1, wherein the line comprises a spun material.

8. The device of claim 1, wherein the line is moving and has a line speed that ranges from 1 foot/minute to 80 feet/minute.

9. The device of claim 1, wherein the bonded display is advanced through the line to effect de-bonding of the display at a rate ranging from about 0.01 feet/minute to about 10 feet/minute.

10. The device of claim 1, wherein the bonded display is contained within a holder during execution of the method to effect de-bonding.

11. The device of claim 1, wherein the line comprises a metal.

12. The device of claim 1, wherein the line comprises a textured conductive material having a rough surface.

13. The device of claim 1, wherein the line is a heated element that is heated to a temperature above ambient temperature during execution of the method.

14. The device of claim 1, further comprising means for vibrating the line wherein the line is vibrated at ultrasonic frequencies during execution of the method.

15. The device of claim 2, further comprising means for providing the moving line being passed through the cured adhesive of the bonded display in a reciprocating motion perpendicular to the direction that the cured adhesive layer is being advanced.

16. The device of claim 1, wherein the line comprises a chemically pretreated element with a chemical that serves to afford bond breakage of the cured adhesive layer.

17. The device of claim 1, wherein the line has a tensile strength (measured in pounds) to diameter (measured in millimeters) value of at least 80 pounds per millimeter for reworking a bonded display having a smaller side dimension of greater than 4 inches.

18. The device of claim 1, wherein the line has a tensile strength (measured in pounds) to diameter (measured in millimeters) value of at least 40 pounds per millimeter for reworking a bonded display having a smaller side dimension of less than or equal to 4 inches.

19. A device for carrying out a method for reworking a bonded liquid crystal display having a surface and a substrate adhesively bonded with a cured adhesive layer to the surface of the display, the device comprising:

a) means for advancing the bonded liquid crystal display, from an edge or a corner of the display to an opposing edge or an opposing corner of the display, through a line in a manner such that the cured adhesive layer contacts the line resulting in break-up of the adhesive layer such that the substrate is no longer bonded to the liquid crystal display; and

b) means for removing the cured adhesive layer from the liquid crystal display to afford a de-bonded liquid crystal display and the substrate.