METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
First Claim
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1. A method of teaching an eyepoint for a wire bonding operation, the method comprising the steps of:
- (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; and
(2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another.
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Abstract
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
15 Citations
21 Claims
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1. A method of teaching an eyepoint for a wire bonding operation, the method comprising the steps of:
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(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of operating a wire bonding machine, the method comprising the steps of:
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(1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint; (2) teaching the eyepoint to the wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device, the teaching step including defining locations of each of the shapes with respect to one another; (3) indexing a first semiconductor device configured to be wire bonded into a predetermined position of the wire bonding machine; and (4) scanning selected portions of the first semiconductor device using a vision system of the wire bonding machine, the selected portions corresponding to the taught eyepoint. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification