LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES
First Claim
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1. A light emitting diode package, comprising:
- a substrate;
a nitride semiconductor light emitting chip arranged on the substrate, a first surface of the nitride semiconductor chip comprising a first-type nitride semiconductor layer, a semi-insulating layer, or an insulating nitride semiconductor layer, a second surface of the nitride semiconductor chip comprising a second-type nitride semiconductor layer, the second surface of the nitride semiconductor chip comprising a concave region, the first-type nitride semiconductor layer being exposed by the concave region;
a passivation layer arranged between the substrate and the nitride semiconductor light emitting chip;
a plurality of electrode patterns arranged between the nitride semiconductor light emitting chip and the substrate; and
a bonding pad arranged at an edge of the substrate.
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Abstract
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
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Citations
20 Claims
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1. A light emitting diode package, comprising:
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a substrate; a nitride semiconductor light emitting chip arranged on the substrate, a first surface of the nitride semiconductor chip comprising a first-type nitride semiconductor layer, a semi-insulating layer, or an insulating nitride semiconductor layer, a second surface of the nitride semiconductor chip comprising a second-type nitride semiconductor layer, the second surface of the nitride semiconductor chip comprising a concave region, the first-type nitride semiconductor layer being exposed by the concave region; a passivation layer arranged between the substrate and the nitride semiconductor light emitting chip; a plurality of electrode patterns arranged between the nitride semiconductor light emitting chip and the substrate; and a bonding pad arranged at an edge of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification