LIGHT EMITTING DEVICE HAVING A PLURALILTY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME
First Claim
1. A light emitting device, comprising:
- a substrate;
a nitride semiconductor light emitting cell mounted on the substrate, a top surface of the nitride semiconductor light emitting cell comprising an n-type nitride semiconductor layer or an un-doped nitride semiconductor layer, a bottom surface of the nitride semiconductor light emitting cell comprising a p-type nitride semiconductor layer and a partially exposed n-type nitride semiconductor layer;
a passivation layer arranged between the substrate and the nitride semiconductor light emitting cell;
a first metal layer arranged between the substrate and the nitride semiconductor light emitting cell, the first metal layer contacting the bottom surface of the nitiride semiconductor light emitting cell; and
a bonding pad connected to the first metal layer, the bonding pad arranged on a portion of the substrate and extending outside of a region under the light emitting cell.
1 Assignment
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Accused Products
Abstract
Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.
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Citations
20 Claims
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1. A light emitting device, comprising:
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a substrate; a nitride semiconductor light emitting cell mounted on the substrate, a top surface of the nitride semiconductor light emitting cell comprising an n-type nitride semiconductor layer or an un-doped nitride semiconductor layer, a bottom surface of the nitride semiconductor light emitting cell comprising a p-type nitride semiconductor layer and a partially exposed n-type nitride semiconductor layer; a passivation layer arranged between the substrate and the nitride semiconductor light emitting cell; a first metal layer arranged between the substrate and the nitride semiconductor light emitting cell, the first metal layer contacting the bottom surface of the nitiride semiconductor light emitting cell; and a bonding pad connected to the first metal layer, the bonding pad arranged on a portion of the substrate and extending outside of a region under the light emitting cell. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification