STRAINED CMOS DEVICE, CIRCUIT AND METHOD OF FABRICATION
First Claim
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1. A method for fabricating a semiconductor device, comprising:
- providing a strained semiconductor layer having a strain in at least one axis;
forming at least one long fin and at least one short fin in the semiconductor layer such that the at least one long fin has a strained length along the at least one axis;
forming an n-type transistor on the at least one long fin; and
forming a p-type transistor on the at least one short fin.
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Abstract
A semiconductor device and fabrication method include a strained semiconductor layer having a strain in one axis. A long fin and a short fin are formed in the semiconductor layer such that the long fin has a strained length along the one axis. An n-type transistor is formed on the long fin, and a p-type transistor is formed on the at least one short fin. The strain in the n-type transistor improves performance.
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Citations
24 Claims
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1. A method for fabricating a semiconductor device, comprising:
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providing a strained semiconductor layer having a strain in at least one axis; forming at least one long fin and at least one short fin in the semiconductor layer such that the at least one long fin has a strained length along the at least one axis; forming an n-type transistor on the at least one long fin; and forming a p-type transistor on the at least one short fin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating a semiconductor device, comprising:
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providing a providing a Strained Silicon Directly on Insulator (SSDOI) wafer with biaxial tensile strain; patterning long fins and short fins in a semiconductor layer of the wafer such that the long fin has a strained length along its longitudinal axis, and the short fins having dimensions to substantially remove residual strain; forming n-type transistors on the long fins including gate structures and raised active area regions such that the gate structures and the raised active area regions provide anchoring to maintain strain in the strain length of the long fins; and forming p-type transistors on the short fins. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A semiconductor device, comprising:
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a strained semiconductor layer formed into at least one long fin and at least one short fin such that the at least one long fin has a strained length; an n-type transistor formed on the at least one long fin wherein the strained length improves device operation; and a p-type transistor formed on the short fin. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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Specification