LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN

• US 20110176286A1
• Filed: 01/10/2011
• Published: 07/21/2011
• Est. Priority Date: 01/21/2010
• Status: Abandoned Application

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: NAKAJIMA, Shigeo, Matsushita, Yoshitaka
• Application Number:
  US12/987,439
• Publication Number:
  US 20110176286A1
• Time in Patent Office: Days
• US Class Current: 361/783
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A lead pin includes a shaft portion, and a connection head portion which is provided on a top end side of the shaft portion and has a diameter larger than a diameter of the shaft portion, and whose whole outer surface is formed of a spherical surface. The connection head portion is formed of a ball shape, an oval spherical shape, or a teardrop-like shape, and also the connection head portion of the lead pin is connected to a wiring substrate by the reflow soldering.

Claims

1. A lead pin, comprising:

a shaft portion; and

a connection head portion which is provided on a top end side of the shaft portion and has a diameter larger than a diameter of the shaft portion, and whose whole outer surface is formed of a spherical surface.

2. A lead pin according to claim 1, wherein the connection head portion is formed of a ball shape, an oval spherical shape whose diameter in a lateral direction is longer than a diameter in a vertical direction, or a teardrop-like shape whose part of maximum diameter is arranged in a position that is displaced from a center part in the vertical direction to a top end side.

3. A wiring substrate with lead pin, comprising:

the lead pin set forth in claim 1; and

a wiring substrate including a pin connection portion;

wherein the connection head portion of the lead pin is connected to the pin connection portion of the wiring substrate via a solder layer.

4. A wiring substrate with lead pin, according to claim 3, wherein the wiring substrate includes a chip connection portion on an opposite surface to a surface on which the pin connection portion is provided, and

a semiconductor chip is connected to the chip connection portion of the wiring substrate.

5. A wiring substrate with lead pin, according to claim 3, wherein a diameter of the connection head portion of the lead pin is set to 40 to 80% of a diameter of the pin connection portion of the wiring substrate.

6. A wiring substrate with lead pin, according to claim 3, wherein the solder layer is formed of a solder paste, and

In the case that a void is generated in the solder layer, the void is located in a position that is displaced outward from a center part of the connection head portion of the lead pin.