Lamp housing and operating lamp

• US 20110176298A1
• Filed: 03/30/2011
• Published: 07/21/2011
• Est. Priority Date: 02/12/2009
• Status: Active Grant

• Current Assignee: Stan Levy, William Henry Meurer
• Original Assignee: Stan Levy, William Henry Meurer
• Inventors: Meurer, William Henry, Levy, Stan
• Granted Patent: US 8,905,577 B2
• Time in Patent Office: Days
• US Class Current: 362/218
• CPC Class Codes: F21K 9/27 Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
• CPC Class Codes: F21V 19/0035 the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A lamp housing uses a tubular metal support functional as a heat radiator within which is an electrical circuit board having a component mounting surface, and in opposition thereto, a thermal transfer surface positioned for conducting heat, from the circuit board to the metal support. A clear lens is secured to the metal support, and a pair of ribs integral to the clear lens extend into contact with the component mounting surface of the circuit board thereby urging the thermal transfer surface toward the metal support for good thermal contact and heat transfer. A thermal transfer tape or paste may be used between the circuit board and the metal support surface upon which it rests. The circuit board may be laid onto the metal support without sliding it into grooves and the clear lens may be snapped into place over the circuit board engaging grooves in the metal support.

Claims

1. A lamp housing apparatus comprising:

a metal support;

an electrical circuit board having a component mounting surface, and in opposition thereto, a thermal transfer surface, the thermal transfer surface positioned for directing heat, by conduction, from the circuit board to the metal support;

a clear lens secured to the metal support, a rib integral to the clear lens in contact with the component mounting surface of the circuit board thereby urging the thermal transfer surface toward the metal support.

2. The apparatus of claim 1 wherein the metal support and the clear lens are both elongate.

3. The apparatus of claim 2 wherein the metal support is tubular, and further comprising an end cap mounted on one end of the lamp housing.

4. The apparatus of claim 3 wherein an electrical circuit is mounted on the circuit board, and an electrode of the electrical circuit is extensive through an aperture in the end cap.

5. The apparatus of claim 2 wherein the metal support has a first elongate securement structure and the clear lens has a second elongate securement structure engaged with the first elongate securement structure thereby securing the clear lens to the metal support.

6. The apparatus of claim 5 wherein the first elongate securement structure includes parallel opposing grooves and the second elongate securement structure includes parallel opposing fingers.

7. The apparatus of claim 4 wherein the circuit board has a first thermal pad mounted on the component mounting surface and a second thermal pad mounted on the thermal transfer surface, a plated through hole joining the first and second thermal pads.

8. The apparatus of claim 7 wherein an electrical component of the electrical circuit is in thermal contact with the first thermal pad.

9. The apparatus of claim 8 wherein the second thermal pad is in contact with the metal support.

10. The apparatus of claim 8 wherein a thermally conductive tape layer is positioned between the second thermal pad and the metal support and is in thermal conduction therewith.

11. The apparatus of claim 8 wherein a thermally conductive paste is positioned between the second thermal pad and the metal support and is in thermal conduction therewith.