METHOD TO PRODUCE HOMOGENEOUS LIGHT OUTPUT BY SHAPING THE LIGHT CONVERSION MATERIAL IN MULTICHIP MODULE

• US 20110176301A1
• Filed: 01/20/2011
• Published: 07/21/2011
• Est. Priority Date: 01/21/2010
• Status: Abandoned Application

• Current Assignee: DSEM Holdings Sdn. Bhd.
• Original Assignee: DSEM Holdings Sdn. Bhd.
• Inventors: Chai, Chew Wui, Yoganandan, Sundar, Liang, Loke Chai
• Application Number:
  US13/010,368
• Publication Number:
  US 20110176301A1
• Time in Patent Office: Days
• US Class Current: 362/231
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Abstract

A multichip module includes a series of light sources arranged in a planar array, separated by a distance d₁ in the x-direction and d₂ in the y-direction apart, or they could be spaced different distances apart which are mounted onto an aluminum oxide metal substrate. A uniform light transmissive layer being disposed over said series of light sources having a thickness t, measure from the top of the light sources. A phosphor resin being formed above this light transmissive layer. An encapsulant having a domed portion which functions as a lens, overlaying the phosphor resin to encapsulate the array of light sources. The light transmissive layer, phosphor resin layer and the encapsulant may be formed using an injection molding process.

Claims

1. A multichip module comprising:

a substrate that is metal base type with metal oxide layer formed on the surface to provide a dielectric layer substantially co-planar with the metal surface;

patterned metal layer formed on the dielectric layer of the substrate;

an array of light sources being mounted and electrically connected to the metal layers;

a light transmissive layer disposed over said array of light sources;

a layer of phosphor resin formed above the surface of the said light transmissive layer;

an encapsulant material overlaying the phosphor resin to encapsulate the said array of light sources, and said encapsulant having a portion shaped as a lens to focus light emitted by the array of light is sources.

2. The multichip module of claim 1 wherein metal base substrate comprises of aluminum.

3. The multichip module of claim 1 wherein patterned metal layer comprises pads for electrical connection, and one or more pads for mounting the light sources.

4. The multichip module of claim 1 wherein pattern metal layer comprises of copper.

5. The multichip module of claim 1 wherein the light sources arranged in a planar array, separated by a distance d₁ in the x-direction and d₂ in the y-direction apart.

6. The multichip module of claim 1 wherein said array of light sources are light emitting dies.

7. The multichip module of claim 6 wherein said array of light emitting dies emits light from the top surface of the dies.

8. The multichip module of claim 1 wherein said light transmissive is layer disposed over said array of light sources having a thickness t measured from the surface of the light sources.

9. The multichip module of claim 1 wherein said light transmissive layer includes material selected from a group consisting of epoxy, silicone, and a hybrid of silicone and epoxy.

10. The multichip module of claim 1 wherein said phosphor resin forms a rectangular or square shape above the surface of the said light transmissive layer.

11. The multichip module of claim 1 wherein said phosphor resin forms an ellipsoidal shape above the surface of the said light transmissive layer.

12. The multichip module of claim 1 wherein said phosphor resin is in the shape of a dome, formed above the surface of the said light transmissive layer.

13. The multichip module of claim 1 wherein said phosphor is selected from the group consisting of yellow phosphors, yellow/green phosphors, red phosphors, green phosphors, orange phosphors, blue phosphors, and combinations thereof.

14. The multichip module of claim 1 wherein the said encapsulant includes material selected from a group consisting of epoxy, silicone, a hybrid of silicone and epoxy, amorphous polyamide resin or fluorocarbon, glass and plastic.

15. A multichip module comprising:

a substrate that is metal base type with metal oxide layer formed on the surface to provide a dielectric layer substantially co-planar with the metal surface;

patterned metal layer formed on the dielectric layer of the substrate;

an array of light sources being mounted and electrically connected to the metal layers;

a light transmissive layer formed having a shape of a dome covering said array of light sources;

a layer of phosphor resin conforming to the shape of the light transmissive layer;

an encapsulant material overlaying the phosphor resin to encapsulate the said array of light sources, and said encapsulant having a portion shaped as a lens to focus light emitted by the array of light sources.

16. The multichip module of claim 15 wherein the metal base substrate comprises of aluminum.

17. The multichip module of claim 15 wherein patterned metal layer comprises pads for electrical connection, and one or more pads for is mounting the light sources.

18. The multichip module of claim 15 wherein pattern metal layer comprises of copper.

19. The multichip module of claim 15 wherein the light sources arranged in a planar array, separated by a distance d₁ in the x-direction and d₂ in the y-direction apart.

20. The multichip module of claim 15 wherein said array of light sources are light emitting dies.

21. The multichip module of claim 20 wherein said array of light emitting dies emit light from the top and all four sides of the dies.

22. The multichip module of claim 15 wherein said light transmissive layer includes material selected from a group consisting of epoxy, silicone and a hybrid of silicone and epoxy.

23. The multichip module of claim 15 wherein said phosphor is selected from the group consisting of yellow phosphors, yellow/green phosphors, red phosphors, green phosphors, orange phosphors, blue phosphors, and combinations thereof.

24. The multichip module of claim 15 wherein the said encapsulant is includes material selected from a group consisting of epoxy, silicone, a hybrid of silicone and epoxy, amorphous polyamide resin or fluorocarbon, glass and plastic.

25. A method for fabricating a multichip module, said method comprising:

providing a substrate that is metal base type with metal oxide layer formed on the surface to provide a dielectric layer which is substantially co-planar with the metal surface;

forming patterned metal layer on the dielectric layer of the substrate;

mounting the light sources and electrically connecting the light sources to the metal layers;

forming a light transmissive layer disposed over said array of light sources;

forming a layer of phosphor resin above said light transmissive layer;

forming an encapsulant overlaying said array of light sources and said substrate, said encapsulant having a portion shaped as a lens to focus light emitted by the array of light sources.

26. The method of claim 25 wherein said metal base substrate comprises of aluminum.

27. The method of claim 25 wherein said patterned metal layer forms is pads for electrical connection, and one or more pads for mounting the light sources.

28. The method of claim 25 wherein said formed pattern metal layer comprises of copper.

29. The method of claim 25 wherein said light sources are formed and bonded in a planar array, separated by a distance d₁ in the x-direction and d₂ in the y-direction apart.

30. The method of claim 25 wherein said array of light sources are light emitting dies.

31. The method of claim 30 wherein said array of light emitting dies emits light from the top surface of the dies or are flip-chip dies.

32. The method of claim 25 wherein said forming said light transmissive layer includes performing an injection molding process to form said light transmissive layer over said array of light sources having a thickness t measured from the surface of the light sources.

33. The method of claim 25 wherein said forming a layer of said phosphor resin includes performing an injection molding process to form a layer of phosphor resin in the shape of a rectangle or square above the surface of the said light transmissive layer.

34. The method of claim 25 wherein said forming said phosphor resin includes performing an injection molding process to form an ellipsoidal shape above the surface of the said light transmissive layer.

35. The method of claim 25 wherein said forming said phosphor resin includes performing an injection molding process to form a dome shape of the phosphor resin above the surface of the said light transmissive layer.

36. The method of claim 25 wherein said forming said encapsulant includes performing an injection molding process to form said encapsulant.

37. A method for fabricating a multichip module, said method comprising:

providing a substrate that is metal base type with metal oxide layer formed on the surface to provide a dielectric layer which is substantially co-planar with the metal surface;

forming patterned metal layer on the dielectric layer of the substrate;

mounting the light sources and electrically connecting the light sources to the metal layers;

forming a light transmissive layer having a shape of a dome over said array of light sources;

forming a layer of phosphor resin that conforms to the shape of said light transmissive layer;

forming an encapsulant overlaying said array of light sources and said substrate, said encapsulant having a portion shaped as a lens to focus light emitted by the array of light sources

38. The method of claim 37 wherein said metal base substrate comprises of aluminum.

39. The method of claim 37 wherein said patterned metal layer forms pads for electrical connection, and one or more pads for mounting the light sources.

40. The method of claim 37 wherein said formed pattern metal layer comprises of copper.

41. The method of claim 37 wherein said light sources are formed and bonded in a planar array, separated by a distance d₁ in the x-direction and d₂ in the y-direction apart.

42. The method of claim 37 wherein said array of light sources are light emitting dies.

43. The method of claim 42 wherein said array of light emitting dies emit light from the top and all four sides of the dies.

44. The method of claim 37 wherein said forming said light transmissive layer includes performing an injection molding process to form the shape of a dome over said array of light sources.

45. The method of claim 37 wherein said forming a layer of said phosphor resin includes performing an injection molding process to form a conformal coating over the surface of the light transmissive layer.

46. The method of claim 37 wherein said forming said encapsulant includes performing an injection molding process to form said encapsulant.