SENSOR ELEMENT AND CARRIER ELEMENT FOR MANUFACTURING A SENSOR
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Abstract
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
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Citations
48 Claims
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1-18. -18. (canceled)
- 19. A sensor element comprising at least one probe element, wherein the sensor element has a holding device for connection to a support element.
- 33. A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation molded in an encapsulation molding process, as a result of which a sensor housing is formed, wherein the sensor element is mechanically connected to a support element, and/or accommodated by the support element, after which the sensor element and the support element are at least partially encapsulation molded in a common encapsulation molding process (M) for forming the sensor housing.
Specification