ELECTRODE ARRAY AND METHOD OF FABRICATION
First Claim
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1. A method of fabricating an electrode array, said method comprising the steps of:
- depositing a first composition on a carrier wafer wherein the first composition defines a longitudinal slit and the first composition forms a first layer of a substrate;
etching the carrier wafer through the longitudinal slit to define a channel underneath the first layer;
depositing a second composition comprising a polymer through the longitudinal slit and onto the carrier wafer to form a tube around the channel and seal the longitudinal slit;
disposing a plurality of feed lines comprised of conductive material on the substrate opposite the tube;
disposing a plurality of electrodes on the substrate with each electrode electrically connected to at least one of the feed lines;
etching the carrier wafer opposite the substrate to define voids with each void exposing an area of the tube;
removing the areas of the tube exposed by the voids to define slots within the tube; and
releasing the tube and substrate from the carrier wafer.
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Abstract
An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.
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Citations
20 Claims
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1. A method of fabricating an electrode array, said method comprising the steps of:
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depositing a first composition on a carrier wafer wherein the first composition defines a longitudinal slit and the first composition forms a first layer of a substrate; etching the carrier wafer through the longitudinal slit to define a channel underneath the first layer; depositing a second composition comprising a polymer through the longitudinal slit and onto the carrier wafer to form a tube around the channel and seal the longitudinal slit; disposing a plurality of feed lines comprised of conductive material on the substrate opposite the tube; disposing a plurality of electrodes on the substrate with each electrode electrically connected to at least one of the feed lines; etching the carrier wafer opposite the substrate to define voids with each void exposing an area of the tube; removing the areas of the tube exposed by the voids to define slots within the tube; and releasing the tube and substrate from the carrier wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electrode array comprising:
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a tube having at least one wall defining a channel; a substrate comprised of non-conductive material and supported at least partially by the tube; a plurality of electrodes comprised of a conductive material and supported by the substrate; and a plurality of feed lines comprised of a conductive material and disposed primarily within the substrate wherein each feed line is electrically connected to at least one of the plurality of electrodes; wherein the at least one wall of the tube defines a plurality of slots into the hollow channel for regulating stiffness and curl of the tube. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An electrode array comprising:
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a tube comprised of Parylene and having at least one wall defining a channel; a substrate comprised of non-conductive material and supported at least partially by the tube; a plurality of electrodes comprised of a conductive material and supported by the substrate; and a plurality of feed lines comprised of a conductive material and disposed primarily within the substrate wherein each feed line is electrically connected to at least one of the plurality of electrodes. - View Dependent Claims (20)
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Specification