LAYERED LENS STRUCTURES AND METHODS OF PRODUCTION

• US 20110180695A1
• Filed: 04/08/2011
• Published: 07/28/2011
• Est. Priority Date: 12/22/2003
• Status: Abandoned Application

• Current Assignee: Round Rock Research LLC
• Original Assignee: Round Rock Research LLC
• Inventors: Li, Jin, Ford, Loriston, Li, Jiutao, Boettiger, Ulrich
• Application Number:
  US13/082,549
• Publication Number:
  US 20110180695A1
• Time in Patent Office: Days
• US Class Current: 250/216
• CPC Class Codes: G02B 3/0018 Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
• CPC Class Codes: G02B 3/0037 characterized by the distribution or form of lenses
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: H01L 27/14627 Microlenses

Abstract

A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal length. The microlenses are arranged in arrays for use in imaging devices.

Claims

1. -19. (canceled)

20. A processor based system comprising:

an imager integrated circuit substrate with a microlens array thereover, the microlens array comprising a lower lens layer, said lower lens having a first focal length; and

an upper lens layer over the lower lens layer, said upper and lower lenses having a combined second focal length different from said first focal length, and wherein the upper lens layer has a curvature having a first radius and the lower lens layer has a curvature having a second radius, wherein the first and second radii are different from one another and the first and second curvatures extend in the same direction, the microlens array supported by the imager IC substrate;

a central processing unit in communication with the imager IC, said communication occurring over a system bus;

a system memory in communication with the central processing unit and imager IC over the system bus; and

an input/output device connected to and in communication with the system bus.

21. The processor based system of claim 20 wherein there is an intervening layer between the imager integrated circuit substrate and the microlens array.

22. The processor based system of claim 20 wherein the lower lens layer of the microlens array is supported by a microlens array substrate interposed between the lower lens layer and the imager integrated circuit substrate.

23. The processor based system of claim 20, wherein the processor based system is selected from the group consisting of computer systems, camera systems, scanners, machine vision systems, vehicle navigation systems, video telephones, surveillance systems, auto focus systems, star tracker systems, motion detection systems, image stabilization systems, and data compression systems for high-definition television.

24. The processor based system of claim 20 wherein the imager integrated circuit substrate has a pixel array wherein the pixel array is arranged in rows and columns.

25. The processor based system of claim 24 wherein the pixel array is operated by a control circuit.

26. The processor based system of claim 20 wherein the imager integrated circuit substrate is selected from the group consisting of a CMOS imager and a CCD imager.

27. The process based system of claim 20 wherein the imager integrated circuit further comprises an image processor that processes an image before output from the imager integrated circuit to the system bus.