LIGHT-EMITTING ARRANGEMENT

• US 20110180819A1
• Filed: 09/09/2009
• Published: 07/28/2011
• Est. Priority Date: 09/16/2008
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: De Koning, Niels, Van Elmpt, Rob F. M., Jacobs, Jean P.
• Application Number:
  US13/063,642
• Publication Number:
  US 20110180819A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

The invention relates to a light-emitting arrangement comprising a printed circuit board, PCB, having at least one electrically and thermally conductive portion, a light-emitting diode, LED, being thermally connected to the at least one electrically and thermally conductive portion by at least one contact of the LED, and a heat release member for dissipating heat generated by the LED, the heat release member being thermally connected to the at least one electrically and thermally conductive portion, wherein the heat generated by the LED is transferred along a heat transfer path extending from the LED via the at least one contact and the at least one electrically and thermally conductive portion to the heat release member.

The light-emitting arrangement according to the invention provides greatly improved heat removal from the LED while using a low-cost glass-epoxy material for the PCB.

Claims

1. Light-emitting arrangement comprising:

a printed circuit board comprising glass-epoxy and having at least one electrically and thermally conductive portion;

a light-emitting diode (LED) for emitting light, said LED being thermally connected to said at least one electrically and thermally conductive portion by at least one contact of said LED; and

a heat release member for dissipating heat generated by said LED, said heat release member being thermally connected to said at least one electrically and thermally conductive portion, said LED and said heat release member being mounted on one side of said printed circuit board;

wherein the heat generated by said LED is transferred along a heat transfer path extending from said LED via said at least one contact and said at least one electrically and thermally conductive portion to said heat release member.

2. Light-emitting arrangement according to claim 1, wherein said contact is an electric contact electrically connecting said LED to said at least one electrically and thermally conductive portion.

3. Light-emitting arrangement according to claim 1, wherein said contact is a heat transfer member.

4. Light-emitting arrangement according to claim 1, wherein said LED comprises a plurality of contacts, including at least one electric contact and at least one heat transfer member.

6. Light-emitting arrangement according to claim 1, wherein said at least one electrically and thermally conductive portion is provided on the same side of said PCB.

7. Light-emitting arrangement according to claim 1, further comprising control circuitry, wherein said control circuitry and said LED are mounted on different sides of said printed circuit board.

8. Light-emitting arrangement according to claim 7, wherein said control circuitry is at least partly embedded in a protective material.

10. Light-emitting arrangement according to claim 1, comprising:

a plurality of LEDs, each LED being thermally connected to said at least one electrically and thermally conductive portion by at least one contact; and

a heat release member for dissipating heat of said plurality of LEDs.

11. Light-emitting arrangement according to claim 1, comprising a plurality of LEDs, each LED being thermally connected to said at least one electrically and thermally conductive portion by at least one contact, and a plurality of heat release members for dissipating heat generated by said plurality of LEDs, wherein heat of at least one of said plurality of LEDs is transferred along a heat transfer path extending from said at least one of said plurality of LEDs to at least one of said plurality of heat release members.

12. Light-emitting arrangement according to claim 1, wherein said heat release member is mounted on said at least one electrically and thermally conductive portion using at least one of solder and glue.

13. Light-emitting arrangement according to claim 1, wherein said heat release member is mounted at a position such that said control circuitry is electromagnetically shielded from said LED.

5. (canceled)

9. Light-emitting arrangement according to claim 5, wherein said heat release member is adapted to receive an optical element.