SOLID STATE LIGHTING DEVICE
First Claim
1. A light emission package adapted for use with at least one solid state emitter, the package comprising:
- a leadframe defining at least one electrical lead; and
a body structure encasing at least a portion of the leadframe, the body structure defining at least one exterior side wall;
wherein a first electrical lead of the at least one electrical lead includes a plurality of first electrical lead segments extending through the at least one exterior side wall, wherein each first electrical lead segment is separated from each other first electrical lead segment along the at least one exterior side wall by at least one first aperture, and at least a portion of the at least one first aperture is disposed outside the at least one exterior wall.
3 Assignments
0 Petitions
Accused Products
Abstract
A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.
67 Citations
50 Claims
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1. A light emission package adapted for use with at least one solid state emitter, the package comprising:
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a leadframe defining at least one electrical lead; and a body structure encasing at least a portion of the leadframe, the body structure defining at least one exterior side wall; wherein a first electrical lead of the at least one electrical lead includes a plurality of first electrical lead segments extending through the at least one exterior side wall, wherein each first electrical lead segment is separated from each other first electrical lead segment along the at least one exterior side wall by at least one first aperture, and at least a portion of the at least one first aperture is disposed outside the at least one exterior wall. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 46, 48)
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17. A light emission package adapted for use with at least one solid state emitter, the package comprising:
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a leadframe defining at least one electrical lead; and a body structure encasing at least a portion of the leadframe, the body structure defining at least one exterior side wall; wherein the at least one electrical lead extends through the at least one exterior side wall; and wherein the at least one exterior side wall defines at least one recess arranged to receive a bent portion of the at least one electrical lead. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 47, 49, 50)
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30. A method for fabricating a light emission package adapted for use with at least one solid state emitter, the method comprising:
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forming a body structure to (i) encase at least a portion of a leadframe defining at least one electrical lead, and (ii) form at least one exterior side wall defining at least one recess; and bending the at least one electrical lead to position at least a portion of the at least one electrical lead within the at least one recess. - View Dependent Claims (31, 32, 33, 34)
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35. A method for fabricating a light emission package adapted for use with at least one solid state emitter, the method comprising:
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defining in a leadframe at least one first aperture to yield a plurality of first electrical lead segments associated with a first electrical lead; forming a body structure to (i) encase at least a portion of the leadframe and (ii) form at least one exterior side wall, wherein upon said forming of the body structure, each first electrical lead segment is separated from each other first electrical lead segment along the at least one exterior side wall by the at least one first aperture, and at least a portion of the at least one first aperture is disposed outside the at least one exterior wall; and bending the plurality of first electrical lead segments. - View Dependent Claims (36, 37, 38, 39)
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40. A light emission package comprising:
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at least one solid state emitter; a heatsink element in thermal communication with the at least one solid state emitter; a leadframe defining a plurality of electrical leads in electrical communication with the at least one solid state emitter; and a body structure encasing at least a portion of the leadframe and arranged to retain the heatsink element, wherein the body structure defines a cavity, and the at least one solid state emitter is disposed within the cavity; wherein the cavity is bounded by a floor, side wall portions, end wall portions, and transition wall portions; wherein a transition wall portion is disposed between each respective side wall portion and end wall portion; and wherein each side wall portion and each end wall portion includes a substantially straight upper edge, and each transition wall portion includes a curved or segmented upper edge transitioning from the upper edge of a side wall portion to the upper edge of an end wall portion. - View Dependent Claims (41, 42, 43, 44, 45)
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Specification