LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

• US 20110180830A1
• Filed: 10/21/2010
• Published: 07/28/2011
• Est. Priority Date: 10/22/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: HWANG, Jung Ha, JO, Kyoung Woo
• Granted Patent: US 8,415,698 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

Claims

1-14. -14. (canceled)

15. A light emitting device comprising:

a light emitting diode chip;

a barrier over the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip.

16. The light emitting device as claimed in claim 15, wherein the barrier is formed on a top surface of an outer peripheral portion of the light emitting diode chip.

17. The light emitting device as claimed in claim 15, wherein the barrier is connected to an outer peripheral portion of the light emitting diode chip.

18. The light emitting device as claimed in claim 15, wherein the barrier includes two barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

19. The light emitting device as claimed in claim 18, wherein at least one of the two barriers is a pad.

20. The light emitting device as claimed in claim 19, wherein at least one of the two barriers is a dummy pad.

21. The light emitting device as claimed in claim 15, wherein the encapsulant has a flat top surface.

22. The light emitting device as claimed in claim 15, wherein the encapsulant has a flat top surface formed with a concavo-convex pattern.

23. The light emitting device as claimed in claim 15, wherein the encapsulant has a hemispherical shape.

24. The light emitting device as claimed in claim 15, wherein the barrier includes at least one of a conductive material, a nonconductive material, and a thixotropic material.

25. A method of manufacturing a light emitting device, the method comprising:

forming a light emitting diode chip;

forming a barrier over the light emitting diode chip; and

forming an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip.

26. The method as claimed in claim 25, wherein the forming of the barrier on the light emitting diode chip includes:

forming a barrier material on the light emitting diode chip; and

forming the barrier on a top surface of an outer peripheral portion of the light emitting diode chip by partially removing the barrier material.

27. The method as claimed in claim 25, wherein the forming of the barrier on the light emitting diode chip includes:

forming the barrier connected to an outer peripheral portion of the light emitting diode chip.

28. The method as claimed in claim 25, wherein the forming of the barrier on the light emitting diode chip includes:

forming the barrier including two barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

29. The method as claimed in claim 25, wherein at least one of the two barriers is a pad or a dummy pad.

30. The method as claimed in claim 25, further comprising removing the barrier after forming the encapsulant.

31. The method as claimed in claim 25, wherein the barrier includes at least one of a conductive material, a nonconductive material, and a thixotropic material.

32. The method as claimed in claim 25, wherein the forming of the encapsulant including the phosphor on the light emitting diode chip includes:

forming the encapsulant having a flat top surface.

33. The method as claimed in claim 32, wherein the encapsulant has a height lower than a height of the barrier.

34. The method as claimed in claim 25, wherein the forming of the encapsulant including the phosphor on the light emitting diode chip includes:

forming the encapsulant having a hemispherical shape.

35. A light emitting device package comprising:

a sub-mount;

a light emitting diode chip over the sub-mount;

a barrier over the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip.

36. The light emitting device as claimed in claim 35, wherein the barrier is formed on a top surface of an outer peripheral portion of the light emitting diode chip.

37. The light emitting device as claimed in claim 35, wherein the encapsulant has a flat top surface.

38. The light emitting device as claimed in claim 35, wherein the encapsulant has a hemispherical shape.