RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
First Claim
1. A method of forming an electronic package, comprising:
- providing a chip having a frontside and a backside;
providing a chip carrier having a top surface and a bottom surface;
bonding the frontside of the chip to the top surface of the chip carrier;
dispensing a seal material at a periphery of the top surface of the chip carrier;
providing a lid;
providing a solder TIM having a first side and a second side, wherein the first side of the TIM contacts the backside of the chip and the second-side of the TIM contacts the lid;
performing a reflow to melt the TIM, wherein the first side of the TIM is bonded to the backside of the chip and the second side of the TIM is bonded to the lid;
curing the seal material, wherein the lid is attached to the top surface of the chip carrier;
injecting backfill material into a space between the top surface of the chip carrier and the lid, wherein the backfill material abuts sides of the TIM and fills the space; and
curing the backfill material.
1 Assignment
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Accused Products
Abstract
A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.
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Citations
26 Claims
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1. A method of forming an electronic package, comprising:
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providing a chip having a frontside and a backside; providing a chip carrier having a top surface and a bottom surface; bonding the frontside of the chip to the top surface of the chip carrier; dispensing a seal material at a periphery of the top surface of the chip carrier; providing a lid; providing a solder TIM having a first side and a second side, wherein the first side of the TIM contacts the backside of the chip and the second-side of the TIM contacts the lid; performing a reflow to melt the TIM, wherein the first side of the TIM is bonded to the backside of the chip and the second side of the TIM is bonded to the lid; curing the seal material, wherein the lid is attached to the top surface of the chip carrier; injecting backfill material into a space between the top surface of the chip carrier and the lid, wherein the backfill material abuts sides of the TIM and fills the space; and curing the backfill material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming an electronic package, comprising:
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providing a chip having a frontside and a backside; providing a chip carrier having a top surface and a bottom surface; bonding the frontside of the chip to the top surface of the chip carrier; dispensing a seal material at a periphery of the top surface of the chip carrier; providing a lid having at least one fill hole and at least one vent hole; providing a TIM having a first side and a second side, wherein the first side of the TIM contacts the backside of the chip and the second side of the TIM contacts the lid; performing a solder reflow to melt the TIM, wherein the first side of the TIM is bonded to the chip and the second side of the TIM is bonded to the lid; injecting backfill material through the fill hole and the vent hole, wherein the backfill material abuts sides of the TIM and fills a cavity between the chip carrier and the lid; and curing the seal material and the backfill material simultaneously, wherein the lid is bonded to the top surface of the chip carrier. - View Dependent Claims (11, 12, 13, 14)
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15. An electronic package, comprising:
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a chip having a frontside and a backside; a chip carrier having a top surface and a bottom surface, wherein the frontside of the chip is bonded to the top surface of the chip carrier; a lid; a TIM having a first side and a second side, wherein the first side of the TIM is in contact with the backside of the chip, the second side of the TIM is bonded to the lid and the lid is attached to the top surface of the chip carrier at a periphery with a seal; and backfill material in a space between the top surface of the chip carrier and the lid, wherein the backfill material abuts sides of the TIM. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification