Integrated antenna and chip package and method of manufacturing thereof
First Claim
1. An integrated antenna and chip package comprising:
- a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material;
a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material;
an antenna disposed on the second substrate;
a communication device coupled to the antenna, wherein the communication device is disposed on the second substrate;
a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough.
1 Assignment
0 Petitions
Accused Products
Abstract
An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
137 Citations
20 Claims
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1. An integrated antenna and chip package comprising:
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a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material; a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material; an antenna disposed on the second substrate; a communication device coupled to the antenna, wherein the communication device is disposed on the second substrate; a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An antenna package lid comprising:
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a thermally conductive body having a top surface, a bottom surface, and four sides disposed between the top and bottom surface, the bottom surface adapted to be mounted to a first substrate; a cavity located within the body and in communication with an opening in the bottom surface, the cavity having a height dimension less than a distance between the top and bottom surfaces, the cavity adapted to fit over an antenna structure coupled to the first substrate, the cavity configured to allow a radiation pattern emitted by the antenna structure to traverse therethrough. - View Dependent Claims (11, 12, 13, 14)
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15. A method for manufacturing an antenna package, the method comprising:
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selecting a first substrate having a first surface and a second surface; coupling a second substrate onto the first surface of the first substrate, the second substrate being made of a dielectric material, wherein the second substrate is in electrical communication with the first substrate; disposing an antenna on the second substrate; coupling a communication device onto the second substrate, wherein the communication device is electrically coupled to the antenna; attaching a lid to the first substrate to encapsulate the antenna and the communication device therein, the lid having a cavity configured to allow radiation from the antenna to be emitted through the lid. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification