CARD DEVICE

• US 20110182037A1
• Filed: 01/18/2011
• Published: 07/28/2011
• Est. Priority Date: 01/28/2010
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Katsumura, Akitomi
• Application Number:
  US13/008,415
• Publication Number:
  US 20110182037A1
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07732 the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks housings for electrical equipment in general, see H05K5/02
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07743 External electrical contacts

Abstract

A card device capable of improving mechanical strength of a mounting substrate with a simple structure is provided. A memory card includes the mounting substrate and a semiconductor package in a package. An electronic component such as a communication component on the mounting substrate is covered with a protective member having an electromagnetic shield function. The protective member is formed by drawing process of a sheet metal, has a containable space by a ceiling section and a side wall, and has a curve section at a joint section between an all rim of the ceiling section and the side wall. A flange is provided on the bottom end of the side wall, and the flange is solder-jointed with a ground region of the mounting substrate. In the protective member having the foregoing structure, stress hardly concentrates locally. Thus, its mechanical strength is large, and rigidity of the mounting substrate is increased.

Claims

1. A card device comprising:

a package;

a mounting substrate on which an electronic component is mounted and which is contained in the package; and

a protective member jointed with the mounting substrate so as to cover at least part of the electronic component,

wherein the protective member forms a containable space by a ceiling section and a side wall, has a curve section at a joint section between a rim of the ceiling section and the side wall, and shows higher rigidity than that of the mounting substrate.

2. The card device according to claim 1, wherein the protective member is formed by drawing process of a sheet metal.

3. The card device according to claim 1, wherein the mounting substrate has a ground region around a mounting region of the electronic component, and the protective member has a flange jointed with the side wall, and the flange is jointed with the ground region.

4. The card device according to claim 1, wherein the protective member is provided with plating treatment, and the resultant protective member is jointed with a ground region of the mounting substrate by solder.

5. The card device according to claim 1, wherein the protective member has an electromagnetic shield function.

6. The card device according to claim 1, wherein the package has a pair of a first cabinet and a second cabinet, and

the package contains the mounting substrate in a space formed by the first cabinet and the second cabinet.

7. The card device according to claim 1, wherein the electronic component has a wireless communication function.

8. The card device according to claim 1, further comprising a semiconductor package having a memory function, wherein

the semiconductor package is jointed with the mounting substrate by being overlapped with a region other than a mounting region of the electronic component.

9. The card device according to claim 8, wherein the semiconductor package includes a card side connector including a card side terminal for inputting/outputting an information signal on a joint face side with the mounting substrate and a package side terminal in a position where the semiconductor package is overlapped with the mounting substrate,

the mounting substrate has a substrate side terminal in a position where the mounting substrate is overlapped with the semiconductor package,

the semiconductor package and the mounting substrate are electrically jointed by the package side terminal and the substrate side terminal, and

overlap joint between the semiconductor package and the mounting substrate is shifted so that the card side connector is exposed.