MOBILE ELECTRONIC DEVICE

• US 20110183729A1
• Filed: 01/27/2011
• Published: 07/28/2011
• Est. Priority Date: 01/27/2010
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: SATOU, Akira
• Granted Patent: US 8,340,732 B2
• Time in Patent Office: Days
• US Class Current: 455/575.1
• CPC Class Codes: H04M 1/0277 for a printed circuit board assembly

Abstract

A mobile electronic device is disclosed. A housing comprises a circuit board located inside the housing. Protection means protects an electronic component located on the circuit board and exposed externally through an external opening in the housing.

Claims

1. A mobile electronic device comprising:

a housing in which an opening is formed;

a circuit board located inside said housing and on which electronic components are mounted;

a first electronic component mounted on said circuit board and exposed to the outside of said housing via said opening; and

a reference potential section located inside said housing and electronically connected to the reference potential,

wherein said housing comprises a partition section forming said opening and partitioning said first electronic component and said reference potential section;

wherein said partition section comprises a through-hole penetrating the side on which said first electronic component is located and the side on which said reference potential section is located; and

wherein the impedance between the outer edge region in which the through-hole of said partition section is formed and said reference potential section is lower than the impedance between the outer edge region in which the through-hole of said partition section is formed and said first electronic component.

2. The mobile electronic device according to claim 1 wherein

the distance between the outer edge region in which the through-hole in said partition section is formed and said reference potential section is shorter than the distance between the outer edge region in which the through-hole in said partition section is formed and said first electronic component.

3. The mobile electronic device according to claim 1 wherein

said first electronic component is surrounded by the mounting side on which said first electronic component of said circuit board is mounted and by said partition section,

said through-hole is formed on an end section of the side on which said first electronic component of said circuit board in said partition section is mounted,

on said circuit board, a second electronic component is located in the region facing the inner surface of said through-hole in said mounting side of said circuit board.

4. The mobile electronic device according to claim 3 wherein

the impedance between the outer edge region in which the through-hole of said partition section is formed and said reference potential section is lower than the impedance between the outer edge region in which the through-hole of said partition section is formed and said second electronic component.

5. The mobile electronic device according to claim 4 wherein

the distance between the outer edge region in which the through-hole of said partition section is formed and said reference potential section is shorter than the distance between the outer edge region in which the through-hole of said partition section is formed and said second electronic component.

6. The mobile electronic device according to claim 1 wherein

said reference potential section comprises a sharp end section t formed to be sharp so as to project toward the outer edge region in which said through-hole of said partition section is formed.

7. The mobile electronic device according to claim 1 comprising:

an antenna, wherein

said first electronic component is a terminal connected to a transmission line through which high frequency waves signals, which are received or transmitted via said antenna, are transmitted.

8. The mobile electronic device according to claim 1 wherein

a third electronic component is mounted on said circuit board, and

wherein said reference potential section is a shield case shielding said third electronic component electronically.

9. The mobile electronic device according to claim 1 wherein

said through-hole penetrates the region facing said first electronic component, specifically the side of said partition section on which said first electronic component is located and the region facing said reference potential section, specifically the side on which said reference potential section is located.