AC_LED SYSTEM IN SINGLE CHIP WITH THREE METAL CONTACTS

• US 20110186881A1
• Filed: 04/08/2011
• Published: 08/04/2011
• Est. Priority Date: 12/09/2005
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Yeh, Wen-Yung, Lin, Ming-Te, Yen, Hsi-Hsuan, Huang, Sheng-Pan, Kuo, Chia-Chang
• Granted Patent: US 8,279,621 B2
• Time in Patent Office: Days
• US Class Current: 257/91
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/42 Antiparallel configurations

Abstract

A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Claims

1. An LED system in a single chip, comprising:

a plurality of LED units on a substrate;

first, second, third, and fourth metal contacts disposed on the substrate;

a first series of LED units having a first end coupled to the first metal contact and a second end coupled to the fourth metal contact;

a second series of LED units having a first end coupled to the second metal contact and a second end coupled to the fourth metal contact; and

a third series of LED units having a first end coupled to the third metal terminal and a second end coupled to the fourth metal contact.

2. An LED system in a single chip as claimed in claim 1, wherein each of the metal contacts is a metal pad.

3. An LED system in a single chip as claimed in claim 1, wherein the first, second, third, and fourth metal contacts are metal pads.

4. An LED system in a single chip as claimed in claim 1, wherein the LED units are disposed with area division between the metal contacts.

5. An LED system in a single chip as claimed in claim 1, wherein at least three of the metal contacts are disposed at the corners of the single chip.

6. An LED system in a single chip as claimed in claim 1, wherein the metal contacts are disposed at the borders of the single chip.

7. An LED system in a single chip, comprising:

a plurality of LED units on a substrate;

four metal contacts disposed on the substrate;

a first series of LED units coupled between two of the four metal contacts;

a second series of LED units coupled between two of the four metal contacts; and

a third series of LED units coupled between two of the four metal contacts;

wherein the LED units and the metal contacts are formed in the single chip.

8. An LED system in a single chip as claimed in claim 7, wherein each of the metal contacts is a metal pad.

9. An LED system in a single chip as claimed in claim 7, wherein three of the metal contacts are metal pads.

10. An LED system in a single chip as claimed in claim 7, wherein the LED units are disposed with area division between the metal contacts.

11. An LED system in a single chip as claimed in claim 7, wherein the metal contacts are disposed at the corners of the single chip.

12. An LED system in a single chip as claimed in claim 7, wherein the metal contacts are disposed at the borders of the single chip.