POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
First Claim
1. A light emitting die package, comprising:
- an electrically insulating substrate comprising a top surface and a bottom surface;
a plurality of traces disposed on the top surface of the substrate;
a light emitting diode (LED) mounted on the top surface of the substrate and connected to the plurality of traces; and
a thermal contact pad disposed on the bottom surface of the substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).
-
Citations
19 Claims
-
1. A light emitting die package, comprising:
-
an electrically insulating substrate comprising a top surface and a bottom surface; a plurality of traces disposed on the top surface of the substrate; a light emitting diode (LED) mounted on the top surface of the substrate and connected to the plurality of traces; and a thermal contact pad disposed on the bottom surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
Specification