MEMS DIAPHRAGM

• US 20110186945A1
• Filed: 03/25/2011
• Published: 08/04/2011
• Est. Priority Date: 10/09/2008
• Status: Active Grant

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: SHIH, HUI-SHEN, Chien, Yu-Fang
• Granted Patent: US 8,492,857 B2
• Time in Patent Office: Days
• US Class Current: 257/419
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/00587 Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579

Abstract

A microelectromechanical system (MEMS) diaphragm is provided. The MEMS diaphragm includes a first conductive layer, a second conductive layer and a first dielectric layer. The first conductive layer is disposed on a substrate and having a plurality of openings. The openings have the same dimension, and the distance between the adjacent openings is gradually increased toward the edge of the first conductive layer. The second conductive layer is disposed between the first conductive layer and the substrate. The first dielectric layer is partially disposed between the first conductive layer and the second conductive layer, so that a portion of the first conductive layer is suspended.

Claims

1. A MEMS diaphragm, comprising:

a first conductive layer, disposed on a substrate and having a plurality of openings, wherein the openings have the same dimension, and a distance between the adjacent openings is gradually increased toward an edge of the first conductive layer;

a second conductive layer, disposed between the first conductive layer and the substrate; and

a first dielectric layer, partially disposed between the first conductive layer and the second conductive layer, so that a portion of the first conductive layer is suspended.

2. The MEMS diaphragm of claim 1, wherein the first conductive layer is shaped as a mesh.

3. The MEMS diaphragm of claim 1, wherein the first conductive layer comprises a plurality of patterns and the openings are disposed between the patterns.

4. The MEMS diaphragm of claim 3, wherein each pattern comprises a winding conductive line.

5. The MEMS diaphragm of claim 4, wherein dimensions of the winding conductive lines are the same or different.

6. The MEMS diaphragm of claim 1, further comprising a second dielectric layer, at least partially disposed between the second conductive layer and the substrate, so that a portion of the second conductive layer is suspended.

7. The MEMS diaphragm of claim 1, wherein the distances comprise a plurality of first distances and a plurality of second distances smaller than the first distances, each of the first distances is at a position apart from the edge of the first conductive layer by a distance smaller than a certain value, and each of the second distances is at a position apart from the edge of the first conductive layer by a distance greater than the certain value.