SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A semiconductor device comprising:
- a first conductive layer;
a second conductive layer wirelessly connected to the first conductive layer;
a regulator circuit electrically connected to the second conductive layer; and
a circuit electrically connected to the regulator circuit,wherein first voltage generated in the second conductive layer is applied to the regulator circuit, andwherein the regulator circuit supplies second voltage based on the first voltage to the circuit.
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Abstract
A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.
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Citations
20 Claims
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1. A semiconductor device comprising:
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a first conductive layer; a second conductive layer wirelessly connected to the first conductive layer; a regulator circuit electrically connected to the second conductive layer; and a circuit electrically connected to the regulator circuit, wherein first voltage generated in the second conductive layer is applied to the regulator circuit, and wherein the regulator circuit supplies second voltage based on the first voltage to the circuit. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a first conductive layer; a second conductive layer wirelessly connected to the first conductive layer; a regulator circuit electrically connected to the second conductive layer; a circuit electrically connected to the regulator circuit; and a pair of structure bodies, wherein the second conductive layer, the regulator circuit and the circuit are interposed between the pair of structure bodies, wherein at least one first antistatic film is formed on at least one surface of one of the pair of structure bodies, wherein at least one second antistatic film is formed on at least one surface of the other of the pair of structure bodies, wherein first voltage generated in the second conductive layer is applied to the regulator circuit, and wherein the regulator circuit supplies second voltage based on the first voltage to the circuit. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor device comprising:
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a first conductive layer; a second conductive layer wirelessly connected to the first conductive layer; a regulator circuit electrically connected to the second conductive layer; and a circuit electrically connected to the regulator circuit, wherein first voltage generated in the second conductive layer is applied to the regulator circuit, wherein the regulator circuit supplies second voltage based on the first voltage to the circuit, and wherein when alternating current flows through one of the first conductive layer and the second conductive layer, induced electromotive force is generated by electromagnetic induction in the other of the first conductive layer and the second conductive layer. - View Dependent Claims (18, 19, 20)
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Specification