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INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES

  • US 20110187227A1
  • Filed: 10/06/2010
  • Published: 08/04/2011
  • Est. Priority Date: 03/31/2009
  • Status: Active Grant
First Claim
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1. A packaged micromechanical resonator, comprising:

  • a substrate;

    a cap comprising integrated circuitry;

    a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;

    a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and

    a second portion of the electrically conductive material between the substrate and the cap constructed and arranged such that a signal can be transmitted between the micromechanical resonator and the integrated circuitry through the second portion of the electrically conductive material.

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