TOUCH-SENSITIVE LIQUID CRYSTAL MODULE AND INTEGRATED TOUCH-SENSITIVE SUBSTRATE THEREOF

• US 20110187671A1
• Filed: 07/14/2010
• Published: 08/04/2011
• Est. Priority Date: 02/04/2010
• Status: Abandoned Application

• Current Assignee: Chunghwa Picture Tubes Limited (Tatung Co., Ltd.)
• Original Assignee: Chunghwa Picture Tubes Limited (Tatung Co., Ltd.)
• Inventors: Huang, Kai-Hung
• Application Number:
  US12/836,410
• Publication Number:
  US 20110187671A1
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

An integrated touch-sensitive substrate including a transparent substrate, an active component array, and a sensing array is provided. The sensing array is disposed between the active component array and the transparent substrate, and includes a plurality of sensing pads, a plurality of wires, an insulation layer, and a plurality of conductive connecting pieces. The insulation layer is located between the wires and the sensing pads. The sensing pads are all located between the insulation layer and the transparent substrate. The conductive connecting pieces are all located in the insulation layer and connected between some of the sensing pads and the wires. In addition, a touch-sensitive liquid crystal module including the integrated touch-sensitive substrate is also provided.

Claims

1. An integrated touch-sensitive substrate, comprising:

a transparent substrate;

an active component array; and

a sensing array, disposed between the active component array and the transparent substrate, and comprising a plurality of sensing pads, a plurality of wires, an insulation layer, and a plurality of conductive connecting pieces, wherein the insulation layer is located between the wires and the sensing pads, the sensing pads are all located between the insulation layer and the transparent substrate, and the conductive connecting pieces are all located in the insulation layer and connected between some of the sensing pads and the wires.

2. The integrated touch-sensitive substrate according to claim 1, wherein the sensing array further comprises a plurality of traces all located between the insulation layer and the transparent substrate and connected to the others of the sensing pads.

3. The integrated touch-sensitive substrate according to claim 1, wherein the wires have a double-layer structure of chromium oxide/chromium.

4. The integrated touch-sensitive substrate according to claim 1, wherein the insulation layer is an organic photoresist layer.

5. The integrated touch-sensitive substrate according to claim 1, further comprising a black matrix layer located between the transparent substrate and the active component array.

6. The integrated touch-sensitive substrate according to claim 5, wherein the black matrix layer is located between the insulation layer and the transparent substrate.

7. The integrated touch-sensitive substrate according to claim 5, wherein the black matrix layer is located between the insulation layer and the active component array.

8. The integrated touch-sensitive substrate according to claim 6, wherein the wires are located between the black matrix layer and the sensing pads.

9. The integrated touch-sensitive substrate according to claim 6, wherein the black matrix layer is located between the wires and the insulation layer, and the conductive connecting pieces pass through the insulation layer and the black matrix layer.

10. The integrated touch-sensitive substrate according to claim 1, further comprising a black matrix layer partially covering the active component array, wherein the active component array is located between the black matrix layer and the transparent substrate.

11. A touch-sensitive liquid crystal module, comprising:

an integrated touch-sensitive substrate, comprising;

a transparent substrate;

an active component array; and

a sensing array, disposed between the active component array and the transparent substrate, and comprising a plurality of sensing pads, a plurality of wires, an insulation layer, and a plurality of conductive connecting pieces, wherein the insulation layer is located between the wires and the sensing pads, the sensing pads are all located between the insulation layer and the transparent substrate, and the conductive connecting pieces are all located in the insulation layer and connected between the sensing pads and the wires;

an opposite substrate;

a liquid crystal layer, disposed between the opposite substrate and the integrated touch-sensitive substrate; and

a backlight source, wherein the opposite substrate is located between the integrated touch-sensitive substrate and the backlight source.

12. The touch-sensitive liquid crystal module according to claim 11, wherein the sensing array further comprises a plurality of traces all located between the insulation layer and the transparent substrate and connected to the others of the sensing pads, and each of the traces is connected between two adjacent sensing pads.

13. The touch-sensitive liquid crystal module according to claim 11, wherein the wires have a double-layer structure of chromium oxide/chromium.

14. The touch-sensitive liquid crystal module according to claim 11, wherein the insulation layer is an organic photoresist layer.

15. The touch-sensitive liquid crystal module according to claim 11, wherein the integrated touch-sensitive substrate further comprises a black matrix layer located between the transparent substrate and the active component array.

16. The touch-sensitive liquid crystal module according to claim 15, wherein the black matrix layer is located between the insulation layer and the transparent substrate.

17. The touch-sensitive liquid crystal module according to claim 15, wherein the black matrix layer is located between the insulation layer and the active component array.

18. The touch-sensitive liquid crystal module according to claim 17, wherein the wires are located between the black matrix layer and the sensing pads.

19. The touch-sensitive liquid crystal module according to claim 17, wherein the black matrix layer is located between the wires and the insulation layer, and the conductive connecting pieces pass through the insulation layer and the black matrix layer.

20. The touch-sensitive liquid crystal module according to claim 11, wherein the integrated touch-sensitive substrate further comprises a black matrix layer partially covering the active component array, and the active component array is located between the black matrix layer and the transparent substrate.