Semiconductor Power Module, Inverter/Converter Including the same, and Method of Manufacturing a Cooling Jacket for Semiconductor Power Module

• US 20110188204A1
• Filed: 01/26/2011
• Published: 08/04/2011
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Hitachi Power Semiconductor Device, Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: HORIUCHI, Keisuke, Hiyoshi, Michiaki, Sasaki, Koji
• Granted Patent: US 8,564,953 B2
• Time in Patent Office: Days
• US Class Current: 361/702
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: Y10T 29/4998 Combined manufacture including applying or shaping of fluent material
• CPC Class Codes: Y10T 29/49989 Followed by cutting or removing material

Abstract

In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.

Claims

1. A semiconductor power module comprising a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket.

2. An inverter module or a converter module comprising the semiconductor power module according to claim 1 and a cooling jacket.

3. The semiconductor power module according to claim 1, further comprising a heatsink, which is in contact with a refrigerant in the cooling jacket to release heat generated from a plurality of power semiconductor elements, and an AC terminal, wherein a DC terminal and the AC terminal protrude from a semiconductor power module body, and the heatsink is arranged on that side of the semiconductor power module body, on which the semiconductor power module is combined with the cooling jacket.

4. The semiconductor power module according to claim 3, wherein the DC terminal is provided on one side of an outer periphery of the semiconductor module, and the AC terminal is provided on an opposite side to the DC terminal, and

further comprising laminated flat plates provided between the DC terminal and the AC terminal, and a low-voltage electrode provided on a separate side from that sides, on which the DC terminal and the AC terminal are provided.

5. The semiconductor power module according to claim 3, wherein a gap is present between the heatsink and the cooling jacket.

6. The semiconductor power module according to claim 4, wherein a conducting plate having a curvature is provided in a position, at which the DC terminal and the laminated flat plates are contact with each other.

7. The semiconductor power module according to claim 5, wherein fins are provided on a side of the heatsink toward the cooling jacket and a gap between tip ends of the fins and the cooling jacket is at least 0.1 mm but at most 2.0 mm.

8. The semiconductor power module according to claim 5, wherein a gap between a base surface of the heatsink and the cooling jacket is at least 0.5 mm.

9. The semiconductor power module according to claim 5, wherein a flow velocity increasing member is provided between the heatsink and the cooling jacket.

10. An inverter/converter comprising the semiconductor power module according to claim 1 and a condenser module connected to the semiconductor power module by the DC terminal, and wherein

the heatsink comprises a base formed with fins,

the inverter/converter is provided on a housing wall thereof with the cooling jacket,

the semiconductor power module comprises an insulated substrate on which a plurality of power semiconductor elements are mounted, the insulated substrate and the heatsink being bonded to an opposite surface to a surface of the base of the heatsink formed with the fins,

the fins are mounted to the housing wall in a manner to be immerged in an opening of the cooling jacket,

the condenser module and the semiconductor power module are arranged on substantially the same plane, the condenser module being arranged adjacent to the semiconductor power module.

11. The inverter/converter according to claim 10, wherein the cooling jacket comprises an inlet pipe and an outlet pipe, and that portion of the cooling jacket, on which the inlet pipe and the outlet pipe are not present, is equal to or less than the semiconductor power module in foot-print size.

12. The inverter/converter according to claim 11, wherein the inlet pipe and the outlet pipe are provided on one side surface of the cooling jacket, a plurality of openings are provided at those sites, at which a plurality of semiconductor power modules are mounted, and the semiconductor power modules are mounted on the respective ones of the plurality of openings, and

further comprising a flow passage, through which a refrigerant is supplied to the respective semiconductor power modules from the inlet pipe, and a flow passage, through which the refrigerant is discharged to the outlet pipe from the respective semiconductor power modules.

13. The inverter/converter according to claim 12, wherein the flow passage, through which the refrigerant is supplied to the respective semiconductor power modules from the inlet pipe, and the flow passage, through which the refrigerant is discharged to the outlet pipe from the respective semiconductor power modules, are positioned in a layer below the openings, on which the respective semiconductor power modules are mounted.

14. The inverter/converter according to claim 13, wherein a plurality of flow passages, through which the refrigerant is supplied to the respective semiconductor power modules from the inlet pipe, and a plurality of flow passages, through which the refrigerant is discharged to the outlet pipe from the respective semiconductor power modules, branch/merge in the layer below the openings, on which the respective semiconductor power modules are mounted.

15. The inverter/converter according to claim 14, wherein the flow passages are formed toward that surface, on which the inlet pipe and the outlet pipe are provided, from a semiconductor power module positioned in a location most distant from that surface, on which the inlet pipe or the outlet pipe is provided, in a manner to connect all the openings, on which the plurality of semiconductor power modules are mounted.

16. The inverter/converter according to claim 10, wherein a flow passage for connection between the openings of the cooling jacket is provided just below the DC terminal and the AC terminal.

17. The inverter/converter according to claim 10, wherein the cooling jacket and the heatsink are subjected to surface preparation.

18. A method of manufacturing a cooling jacket for a semiconductor power module, the cooling jacket being provided with an opening at a site, at which a heatsink of the semiconductor power module is mounted, said semiconductor power module comprising an insulated substrate on which a plurality of power semiconductor elements are mounted, the heatsink for release of heat generated from the plurality of power semiconductor elements, a DC terminal, through which a DC current is supplied to the power semiconductor elements, an AC terminal, through which an AC current is taken out from the power semiconductor elements, a chuck for machining, an inlet pipe, an outlet pipe, and bolt holes for fastening of the semiconductor power module,

wherein the cooling jacket is integrally molded by means of casting and then subjected to machining of the inlet pipe, the outlet pipe, and the bolt holes for fastening of the semiconductor power module, and has a wall having a draft angle of 1°

or more.

19. The method of manufacturing a cooling jacket for a semiconductor power module, according to claim 18, wherein the opening at that site, at which the heatsink is mounted, is smaller in cross sectional area than the remaining flow passages.

20. The method of manufacturing a cooling jacket for a semiconductor power module, according to claim 18, wherein a space is provided on a bottom surface in an opposite position to the opening, on which the heatsink of the cooling jacket is mounted.

21. The method of manufacturing a cooling jacket for a semiconductor power module, according to claim 18, wherein after the cooling jacket is cast, a resin is poured into molding cavities and gaps of sintered parts to cure to fill in unnecessary voids and then the cooling jacket is subjected to surface preparation.