METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT BOARD, DEVICE FOR CONNECTION THEREOF, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS

• US 20110188214A1
• Filed: 01/25/2011
• Published: 08/04/2011
• Est. Priority Date: 01/29/2010
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: MISHIRO, Kinuko
• Application Number:
  US13/012,861
• Publication Number:
  US 20110188214A1
• Time in Patent Office: Days
• US Class Current: 361/749
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

A method for connection of a flexible circuit board to a rigid circuit board is provided. The method includes supplying an adhesive agent onto a first electrode pattern provided on one surface of the rigid circuit board. The rigid circuit board has a plurality of electronic components mounted on the other surface with a gap therebetween. The method also includes aligning a second electrode pattern provided on the flexible circuit board to the first electrode pattern of the rigid circuit board. The adhesive agent is heated under pressure to electrically connect the second electrode pattern to the first electrode pattern by pressing the gap between the plurality of electronic components with a jig which has a press-contact section of a narrower width than the gap.

Claims

1. A method for connection of a flexible circuit board to a rigid circuit board comprising:

supplying an adhesive agent onto a first electrode pattern provided on one surface of the rigid circuit board, the rigid circuit board including a plurality of electronic components mounted on the other surface with a gap therebetween;

aligning a second electrode pattern provided on the flexible circuit board to the first electrode pattern of the rigid circuit board;

heating under pressure the adhesive agent to electrically connect the second electrode pattern to the first electrode pattern by pressing the gap between the plurality of electronic components with a jig having a press-contact section of a narrower width than the gap.

2. The method for connection according to claim 1, wherein the press-contact location of the jig includes an elongated projection member having a width equal to or greater than the first electrode pattern of the rigid circuit board, and the gap of the plurality of electronic components is pressed by the elongated projection member.

3. The method for connection according to claim 1, wherein the press-contact section of the jig includes two or more projection members spaced one apart from another, and the gap of the plurality of electronic components is pressed by the projection members.

4. The method for connection according to claim 1, wherein the first electrode pattern includes a plurality of conductor patterns extending in parallel with one another.

5. The method for connection according to claim 4, wherein the second electrode pattern includes a plurality of conductor patterns extending in parallel with one another.

6. The method for connection according to claim 5, wherein the conductor patterns of the first electrode pattern and the conductor patterns of the second electrode pattern are overlapped with each other in a one-on-one relationship.

7. The method for connection according to claim 1, wherein the gap between the adjacent electronic components in the plurality of electronic components mounted on one side of the first printed circuit board has a width narrower than the length of the conductor patterns of the first electrode pattern and is pressed by the press surface which extends longer than the width of the gap.

8. The method for connection according to claim 1, wherein the adhesive agent is an anisotropically conductive adhesive agent that includes conductive particles dispersed in thermosetting resin and exerts conductivity in a direction crossing an adhesive surface.

9. The method for connection according to claim 8, wherein the adhesive agent is cured by heating.

10. A device for connection of a flexible circuit board to a rigid circuit board comprising:

a first jig holding the rigid circuit board thereon, the rigid circuit board including a first electrode pattern provided on one surface and a plurality of electronic components mounted on the other surface with a gap therebetween;

a second jig pressing the flexible circuit board including a second electrode pattern to the rigid circuit board;

a supply mechanism supplying an adhesive agent onto the first electrode pattern;

an alignment mechanism aligning the second electrode pattern provided on the flexible circuit board to the first electrode pattern; and

a heating mechanism heating the adhesive agent,

wherein the first jig includes a press-contact section having a narrower width than the gap to press the gap between the plurality of electronic components.

11. The device for connection according to claim 10, wherein the press-contact section of the jig includes an elongated projection member having a width equal to or greater than the first electrode pattern of the rigid circuit board, and the gap of the plurality of electronic components is pressed by the elongated projection member.

12. The device for connection according to claim 10, wherein the press-contact section of the jig includes two or more projection members spaced one apart from another, and the gap of the plurality of electronic components is pressed by the projection members.

13. A printed circuit board assembly, comprising:

a rigid circuit board including a first electrode pattern provided on one surface and a plurality of electronic components mounted on the other surface with a gap therebetween;

a flexible circuit board including a second electrode pattern aligned with the first electrode pattern; and

an adhesive agent interposed between the flexible circuit board and the rigid circuit board to electrically connect the first electrode pattern to the second electrode pattern,

wherein a bonding area within the first electrode pattern corresponds to the gap between the plurality of electronic components.

14. The printed circuit board assembly according to claim 13, wherein the first electrode pattern includes a plurality of conductor patterns extending in parallel with one another.

15. The printed circuit board assembly according to claim 14, wherein the second electrode pattern includes a plurality of conductor patterns extending in parallel with one another.

16. The printed circuit board assembly according to claim 15, wherein the conductor patterns of the first electrode pattern and the conductor patterns of the second electrode pattern are overlapped with each other in a one-on-one relationship.

17. An electronic apparatus, comprising:

an enclosure; and

a printed circuit board assembly installed in the enclosure, wherein the printed circuit board assembly includes;

a rigid circuit board including a first electrode pattern provided on one surface and a plurality of electronic components mounted on the other surface with a gap therebetween;

a flexible circuit board including a second electrode pattern aligned with the first electrode pattern; and

an adhesive agent interposed between the flexible circuit board and the rigid circuit board to electrically connect the first electrode pattern to the second electrode pattern, wherein a bonding area within the first electrode pattern corresponds to the gap between the plurality of electronic components.