System And Method For Wireless Communication In A Backplane Fabric Architecture

• US 20110188417A1
• Filed: 04/12/2011
• Published: 08/04/2011
• Est. Priority Date: 06/22/2007
• Status: Active Grant

• Current Assignee: Vubiq Networks, Inc.
• Original Assignee: Vubiq, Inc.
• Inventors: Pettus, Michael Gregory, Bardeen, James Robert Amos
• Granted Patent: US 8,422,414 B2
• Time in Patent Office: Days
• US Class Current: 370/310
• CPC Class Codes: G06F 13/385 for adaptation of a particular data processing system to different peripheral devices
• CPC Class Codes: G06F 13/409 Mechanical coupling back panels H05K7/1438
• CPC Class Codes: G06F 2213/3814 Wireless link with a computer system port
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A wireless millimeter wave backplane network and method comprises a first circuit board that has a first module thereon, wherein the first circuit board is coupled to a high speed backplane. The network includes a first communication node that is coupled to the first module and which is disposed on the first circuit board. The network includes a second circuit board that has a second module thereon, wherein the second circuit board is coupled to the high speed backplane. The network includes a second communication node that is coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

Claims

1. A wireless millimeter wave backplane network comprising:

a first circuit board within a first housing and having a first module thereon, wherein the first circuit board is coupled to a high speed backplane;

a first communication node coupled to the first module and disposed on the first circuit board;

a second circuit board within a second housing remote from the first housing, the second circuit board having a second module thereon, the second circuit board coupled to the high speed backplane; and

a second communication node coupled to the second module and disposed on the second circuit board, wherein the first and second modules wirelessly communicate using millimeter wave electromagnetic radiation with one another via the first and second communication nodes.

2. The network of claim 1 wherein the first communication node further comprises:

a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material;

a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material;

a communication element disposed on the second substrate, wherein the communication element includes an antenna and a communication device coupled to the antenna;

a lid coupled to the first substrate and configured to encapsulate the communication element, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough.

3. The network of claim 2, wherein the communication element further comprises a plurality of transmitters coupled to respective transmitting antennas, wherein the transmitters and transmitting antennas are all disposed on the second substrate.

4. The network of claim 2, wherein the communication element further comprises a plurality of receivers coupled to respective receiving antennas, wherein the receivers and receiving antennas are all disposed on the second substrate.

5. The network of claim 1 further comprising a data source disposed on the first circuit board and coupled to the first communication node, wherein the data source provides at least operational information to the first communication node.

6. The network of claim 1 wherein the first communication node and the second communication node wirelessly communicate to perform a switching function between the first and second modules without using a central switch.

7. The network of claim 1 wherein the first communication node and the second communication node communicate using time division multiplexing access and frequency division multiplexing access.

8. The network of claim 1 further comprising an intermediate communication node having a transmitter antenna and a receiver antenna, wherein the intermediate communication node receives the communication from the first communication transmits the data packet to the second communication node.

9. A method for wirelessly communicating between a plurality of modules in a high speed backplane fabric, the method comprising:

selecting a destination communication node to receive a data packet, the destination communication node having at least a receiving antenna and coupled to a first circuit board within a first housing, wherein the first circuit board is coupled to a high speed backplane;

wirelessly transmitting the data packet using millimeter waves from a source communication node via a transmitting antenna to the destination communication node, the source communication node coupled to a second circuit board within a second housing that is remotely located from the first housing, wherein the second circuit board is coupled to the high speed backplane.

10. The method of claim 9, further comprising identifying an operating parameter for the data packet, wherein the operating parameter at least includes an address of the destination node.

11. The method of claim 10, wherein the operating parameter further includes a frequency hopping sequence and a time counter for the frequency hopping sequence.

12. The method of claim 10, wherein the operating parameter includes information identifying a node other than the destination node which is capable of receiving the data packet.

13. The method of claim 9, wherein the source communication node operates a selected power setting and the destination communication node operates a selected sensitivity setting to allow successful transmission of the data packet therebetween.

14. The method of claim 9, further comprising receiving the data packet at the destination node, wherein the received data packet is transmitted to a data sink coupled to the destination node.

15. The method of claim 9, wherein the source communication node autonomously selects and transmits to the destination communication node without using a central switching module.

16. The method of claim 9, wherein the source communication node and destination communication node communicate the data packet using MIMO technology.