TEST STRIP EJECTION MECHANISM

• US 20110189062A1
• Filed: 02/04/2010
• Published: 08/04/2011
• Est. Priority Date: 02/04/2010
• Status: Active Grant

• Current Assignee: Cilag Gmbh International (Johnson & Johnson)
• Original Assignee: LifeScan Scotland Limited (Johnson & Johnson)
• Inventors: Valsecchi, Luca, DeAngeli, Marco
• Granted Patent: US 8,057,753 B2
• Time in Patent Office: Days
• US Class Current: 422/400
• CPC Class Codes: G01N 33/48757 Test elements dispensed from a stack

Abstract

A test strip ejection mechanism, for use with a test strip receiving port and a test strip, includes a framework, an elongated shape memory alloy (SMA) strip (e.g., a SMA wire), a slider, and a heating module. The SMA strip has first and second ends that are attached to the framework and exhibits a solid state transition temperature. The slider is configured to travel along the framework. The heating module is configured to heat the SMA strip from a temperature below the solid state transition temperature to a temperature above the solid state transition temperature. Moreover, the SMA strip and slider are configured such that the slider travels along the framework under an applied force exerted on the slider by the SMA strip as the shape memory strip is heated from a temperature below the solid state transition temperature to a temperature above the solid state temperature by the heating module. In addition, the slider has a proximal end configured to engage a test strip received within a test strip receiving port and eject the test strip from the test strip receiving port as the slider travels along the framework. A test meter for use with a test strip includes a test strip receiving port and a test strip ejection mechanism.

Claims

1. A test strip ejection mechanism for use with a test strip receiving port and a test strip, the test strip ejection mechanism comprising:

a framework attached to the test strip receiving port;

an elongated shape memory alloy strip with a longitudinal axis, a first end and a second end, the first end and second end constrained by attachment to the framework, the shape memory alloy strip exhibiting a solid state transition temperature;

a slider configured to travel along the framework; and

a heating module configured to heat the shape memory alloy strip from a temperature below the solid state transition temperature to a temperature above the solid state transition temperature;

wherein the shape memory alloy strip and slider are configured such that the slider travels along the framework under an applied force exerted on the slider by the shape memory alloy strip as the shape memory strip is heated by the heating module from a temperature below the solid state transition temperature to a temperature above the solid state temperature; and

wherein the slider has a proximal end configured to engage a test strip received within the test strip receiving port and eject the test strip from the test strip receiving port as the slider travels along the framework.

2. The test strip ejection mechanism of claim 1 further including:

a spring configured to return and hold the shape memory alloy strip in a deformed configuration when the shape memory alloy strip is at a temperature below the solid state transition temperature and enable the shape memory alloy strip to move to a programmed configuration when the shape memory alloy strip is heated to a temperature above the solid-state transition temperature.

3. The test strip injection mechanism of claim 2 further including:

a spindle, and

wherein the spring is disposed around the spindle in an annular configuration and the spring exerts a force on the slider via the spindle.

4. The test strip ejection mechanism of claim 1 wherein the shape memory alloy strip is in a deformed configuration when the shape memory alloy strip is at a temperature below the solid state transition temperature and the shape memory alloy strip is in a programmed configuration when the shape memory alloy strip is heated to a temperature above the solid-state transition temperature.

5. The test strip ejection mechanism of claim 4 wherein the longitudinal axis of the shape memory alloy in the deformed configuration is a bowed configuration and the longitudinal axis of the shape memory alloy strip in the programmed configuration is in an essentially a straight-line configuration.

6. The test strip ejection mechanism of claim 5 wherein the straight-line configuration is essentially perpendicular to a test strip ejection direction.

7. The test strip ejection mechanism of claim 1 wherein the heating module is configured to heat the shape memory alloy strip by forcing an electrical current through the shape memory alloy strip.

8. The test strip ejection mechanism of claim 1 wherein the shape memory alloy strip is a shape memory alloy wire.

9. The test strip ejection mechanism of claim 8 wherein the shape memory alloy wire is a Nickel-Titanium shape memory alloy wire.

10. The test strip ejection mechanism of claim 1 further including:

a first crimp; and

a second crimp, and

wherein the first end and second ends of the shape memory alloy strip are constrained by attachment to the framework via the first crimp and a second crimp, respectively.

11. A test meter for use with a test strip, the test meter comprising:

a test strip receiving port configured to receive, and have ejected therefrom, a test strip;

a test strip ejection mechanism that includes;

a framework attached to the test strip receiving port;

an elongated shape memory alloy strip with a longitudinal axis, a first end and a second end, the first end and second end attached to the framework, the shape memory alloy strip exhibiting a solid state transition temperature;

a slider configured to travel along the framework; and

a heating module configured to heat the shape memory alloy wire from a temperature below the solid state transition temperature to a temperature above the solid state transition temperature;

wherein the shape memory alloy strip and slider are configured such that the slider travels along the framework under an applied force exerted on the slider by the shape memory alloy strip as the shape memory strip is heated by the heating module from a temperature below the solid state transition temperature to a temperature above the solid state temperature; and

wherein the slider has a proximal end configured to engage a test strip received within the test strip receiving port and eject the test strip from the test strip receiving port as the slider travels along the framework.

12. A test meter for use with a test strip, the test meter comprising:

a test strip receiving port configured to receive, and have ejected therefrom, a test strip;

a test strip ejection mechanism that includes;

a framework attached to the test strip receiving port;

an elongated shape memory alloy strip with a longitudinal axis, a first end and a second end, the first end and second end attached to the framework, the shape memory alloy strip exhibiting a solid state transition temperature;

a slider configured to travel along the framework;

a heating module configured to heat the shape memory alloy wire from a temperature below the solid state transition temperature to a temperature above the solid state transition temperature; and

a test strip receiving port framework;

wherein the shape memory alloy strip and slider are configured such that the slider travels along the framework under an applied force exerted on the slider by the shape memory alloy strip as the shape memory strip is heated by the heating module from a temperature below the solid state transition temperature to a temperature above the solid state temperature; and

wherein the slider has a proximal end configured to engage a test strip received within the test strip receiving port and eject the test strip from the test strip receiving port as the slider travels along the framework, and

wherein the test strip receiving port and test strip ejection mechanism are attached to the test strip receiving port framework.

13. The test meter of claim 12 further including:

an optical sensor module attached to the framework; and

a signal processing module.

14. The test meter of claim 12 wherein the test strip ejection mechanism further includes:

a spring configured to return and hold the shape memory alloy strip in a deformed configuration when the shape memory alloy strip is at a temperature below the solid state transition temperature and enable the shape memory alloy strip to move to a programmed configuration when the shape memory alloy strip is heated to a temperature above the solid-state transition temperature.

15. The test meter of claim 14 wherein the test strip ejection mechanism further includes:

a spindle, and

wherein the spring is disposed around the spindle in an annular configuration and the spring exerts a force on the slider via the spindle.

16. The test meter of claim 12 wherein the shape memory alloy strip is in a deformed configuration when the shape memory alloy strip is at a temperature below the solid state transition temperature and the shape memory alloy strip is in a programmed configuration when the shape memory alloy strip is heated to a temperature above the solid-state transition temperature.

17. The test meter of claim 16 wherein the longitudinal axis of the shape memory alloy in the deformed configuration is in essentially a bowed configuration and the longitudinal axis of the shape memory alloy strip in the programmed configuration is in an essentially a straight-line configuration.

18. The test meter of claim 17 wherein the straight-line configuration is essentially perpendicular to a test strip ejection direction.

19. The test meter of claim 12 wherein the heating module is configured to heat the shape memory alloy strip by forcing an electrical current through the shape memory alloy strip.

20. The test meter of claim 12 wherein the shape memory alloy strip is a shape memory alloy wire.

21. The test meter of claim 20 wherein the shape memory alloy wire is a Nickel-Titanium shape memory alloy wire.

22. The test meter claim 12 wherein the test strip ejection mechanism further includes:

a first crimp; and

a second crimp, and

wherein the first end and second ends of the shape memory alloy strip are attached to the framework via the first crimp and a second crimp, respectively.