HEADER ASSEMBLY FOR IMPLANTABLE MEDICAL DEVICE

• US 20110190833A1
• Filed: 01/29/2010
• Published: 08/04/2011
• Est. Priority Date: 01/29/2010
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Fischer, Jean-Francois, Engmark, David B., Ries, Andrew J., Kast, John E.
• Granted Patent: US 9,403,022 B2
• Time in Patent Office: Days
• US Class Current: 607/2
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/37518 Anchoring of the implants, e.g. fixation
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01R 13/5224 for medical use
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

This disclosure includes an implantable medical device comprising: a housing; at least one module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient; one or more feedthroughs extending through the housing; a header assembly including one or more electrical connectors electrically coupled to the module via the feedthroughs; and a preformed gasket compressed between the housing and the header assembly forming a seal to electrically isolate the feedthroughs from an external environment.

Claims

1. An implantable medical device comprising:

a housing;

a module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient;

one or more feedthroughs extending through the housing;

a header assembly including one or more electrical connectors electrically coupled to the module via the feedthroughs; and

a preformed gasket compressed between the housing and the header assembly forming a seal to electrically isolate the feedthroughs from an external environment.

2. The implantable medical device of claim 1, wherein the preformed gasket is elastically deformed as compressed between the housing the header assembly.

3. The implantable medical device of claim 1, wherein the preformed gasket includes a projection around a perimeter of the gasket, the projection facing the header assembly and functioning to concentrate sealing force between the gasket and the header assembly at the perimeter of the gasket.

4. The implantable medical device of claim 1, wherein the preformed gasket comprises a silicon material.

5. The implantable medical device of claim 1, wherein the preformed gasket comprises a polyether resin.

6. The implantable medical device of claim 1, wherein the preformed gasket is bonded to the header assembly such that the header assembly and the preformed gasket serve as a unitary component.

7. The implantable medical device of claim 1, wherein the electrical connectors include one or more solderless connectors mated to the feedthroughs, wherein each of the solderless connectors comprises an electrically conductive spring member forming a central aperture, the spring member deformed to receive a corresponding feedthrough in its central aperture and form an electrical connection with the corresponding feedthrough.

8. The implantable medical device of claim 1, wherein the preformed gasket includes one or more apertures corresponding to the feedthroughs, wherein each feedthrough extends through a different one of the apertures.

9. The implantable medical device of claim 1, further comprising:

a set of brackets secured to the housing and extending into the header assembly; and

a set of pins extending through the brackets and into the header assembly to secure the header assembly to the housing at a position that compresses the preformed gasket between the housing and the header assembly.

10. The implantable medical device of claim 9, wherein the preformed gasket includes a set of apertures corresponding to the brackets, wherein each bracket extends through a different one of the apertures.

11. The implantable medical device of claim 1, further comprising a set of brackets secured to the housing and extending into the header assembly,

wherein the header assembly includes a set of slots configured to mate with the set of brackets,

wherein the header assembly further includes a snap-on tab within each of the set of slots, and

wherein each snap-on tab mates with a corresponding bracket to mechanically secure the header assembly to the housing.

12. The implantable medical device of claim 1, wherein the header assembly is a lead connector assembly.

13. The implantable medical device of claim 12, wherein header assembly comprises a lead connector assembly, wherein the electrical connectors each include one or more connector blocks, wherein the electrical connectors each define an opening configured to receive a medical lead.

14. The implantable medical device of claim 1, wherein the one or more feedthroughs include a plurality of feedthroughs, wherein the seal electrically isolates the feedthroughs from each other.

15. A method of manufacturing an implantable medical device comprising:

obtaining a subassembly including;

a substantially sealed housing, a module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient, and one or more feedthroughs extending through the housing;

obtaining a header assembly including one or more electrical connectors;

obtaining a preformed gasket configured to electrically isolate the feedthroughs from an external environment when the header assembly is mounted to the substantially sealed housing;

positioning the preformed gasket between the header assembly and the housing;

positioning the header assembly on the housing to form one or more electrical connections between the feedthroughs and the electrical connectors and compress the preformed gasket between the header assembly and the housing to form a seal that electrically isolates the feedthroughs from the external environment; and

mechanically securing the header assembly to the housing to maintain the seal provided by the preformed gasket.

16. The method of claim 15, wherein the preformed gasket is elastically deformed as compressed between the housing the header assembly.

17. The method of claim 15, wherein the preformed gasket includes a projection around a perimeter of the gasket, the projection facing the header assembly and functioning to concentrate sealing force between the gasket and the header assembly at the perimeter of the gasket.

18. The method of claim 15, wherein the preformed gasket comprises a silicon material.

19. The method of claim 15, wherein the preformed gasket comprises a polyether resin.

20. The method of claim 15, wherein the preformed gasket is bonded to the header assembly such that the header assembly and the preformed gasket serve as a unitary component.

21. The method of claim 15, wherein the electrical connectors include one or more solderless connectors mated to the feedthroughs, wherein each of the solderless connectors comprises an electrically conductive spring member forming a central aperture, the spring member deformed to receive a corresponding feedthrough in its central aperture and form an electrical connection with the corresponding feedthrough.

22. The method of claim 15, wherein the preformed gasket includes one or more apertures corresponding to the feedthroughs, wherein each feedthrough extends through a different one of the apertures once the header assembly is secured to the housing.

23. The method of claim 15, wherein the subassembly includes a set of brackets secured to the housing, wherein mechanically securing the header assembly to the housing comprises forcing a set of pins through the brackets and into the header assembly to secure the header assembly to the housing at a position that compresses the preformed gasket between the housing and the header assembly.

24. The method of claim 23, wherein the preformed gasket includes a set of apertures corresponding to the brackets, wherein each bracket extends through a different one of the apertures once the header assembly is secured to the housing.

25. The method of claim 15,

wherein the subassembly includes a set of brackets secured to the housing,

wherein the header assembly includes a set of slots configured to mate with the set of brackets,

wherein the header assembly further includes a snap-on tab within each of the set of slots,

wherein the method further comprises pressing the header assembly on to the housing to compress the preformed gasket until each snap-on tab mates with a corresponding bracket to mechanically secure the header assembly to the housing.

26. The method of claim 15, wherein the header assembly is a lead connector assembly.

27. The method of claim 26, wherein header assembly comprises a lead connector assembly, wherein the electrical connectors each include one or more connector blocks, wherein the electrical connectors each define an opening configured to receive a medical lead.

28. The method of claim 15, wherein the one or more feedthroughs include a plurality of feedthroughs, wherein the seal electrically isolates the feedthroughs from each other.

29. An implantable medical device comprising:

a housing;

a module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient;

one or more feedthroughs extending through the housing;

a header assembly including an electrical connector electrically coupled to the module via the feedthroughs; and

means for electrically isolating the feedthroughs from an external environment.

30. The implantable medical device of claim 29, further comprising means for mechanically securing the header assembly to the housing.