Method for Bonding a Layer of Silicone to a Substrate of Methacrylate Polymer

• US 20110193006A1
• Filed: 08/13/2008
• Published: 08/11/2011
• Est. Priority Date: 08/13/2007
• Status: Active Grant

• Current Assignee: Menarini Silicon Biosystems S.P.A
• Original Assignee: Silicon Biosystems, S.p.A.
• Inventors: Medoro, Gianni, Simone, Guiseppina, Perozziello, Gerardo
• Granted Patent: US 8,557,350 B2
• Time in Patent Office: Days
• US Class Current: 251/366
• CPC Class Codes: C09J 2400/228 in the pretreated surface to be joined
• CPC Class Codes: C09J 2433/008 in the pretreated surface to be joined
• CPC Class Codes: C09J 2483/00 Presence of polysiloxane
• CPC Class Codes: C09J 5/02 involving pretreatment of the surfaces to be joined
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Method of bonding a layer (S) of silicone to a substrate (4′) of methacrylic polymer; the method involves positioning between the methacrylate polymer and the silicone a layer (9) of an organosilane having the formula R¹Si(R²)₃, in which R² is OH and R¹ is a methacrylic residue.

Claims

1. A method for bonding a substrate (4) with at least one layer of silicone (S) in order to obtain a composite (V);

the method is characterised in that it comprises

a first phase of application, during which a first layer (9) comprising at least one organosilane

is applied to at least one first surface of the substrate (4);

a second phase of application, during which a second layer (S) comprising silicone is applied on the first layer (9);

the organosilane having, during the second phase of application, at least one silicon bonded with at least one hydroxy;

the method further comprising;

a phase of surface treatment, which precedes the first phase of application and during which at least either the first or a second surface of the substrate (4) is treated so that the first surface has an angle of contact greater than an angle of contact of the second surface;

during the first phase of application, the organosilane deposits selectively on the first surface with respect to the second surface.

3. The method as claimed in claim 1 or wherein the first surface comprises at least one polymeric material.

4. The method as claimed in claim 3, wherein the polymeric material is an acrylic polymer.

5. The method as claimed in claim 1, wherein the organosilane has, before the second phase of application, a silicon bonded with three substituents chosen, independently of one another, from the group consisting of:

hydroxy, alkoxy C₁-C₆.

8. The method as claimed in claim 5, wherein the organosilane, during the second phase of application, has a silicon bonded with three hydroxies.

10. The method as claimed in claim 1, wherein the organosilane has, during the second phase of application, formula R¹Si(R²)₃, wherein each R² represents a hydroxy;

R¹ represents a methacrylic residue having the following structure;

12. The method as claimed in claim 1, claims, wherein the silicone has the following formula:

[R₂SiO]_n

in which n is a whole number greater than 4, each R is chosen, independently of the others, from the group consisting of;

methyl, ethyl, propyl.

13. The method as claimed in claim 1, and comprising a phase of activation, which is subsequent to the first phase of application and during which the silicone and the organosilane are activated superficially by means of plasma treatment.

14. The method as claimed in claim 1, wherein the difference between the angles of contact of the first surface and the organosilane is less than 20°

.

15. The method as claimed in claim 1, during the first phase of application, the first layer (9) is applied by means of evaporation or atomisation and subsequent condensation of the organosilane.

17. The method as claimed in claim 1, wherein, after the surface treatment phase, the difference between the angles of contact of the first and second surface is at least 30°

.

18. The method as claimed in claim 1, wherein, during the surface treatment phase, either the first or the second surface of the substrate (4) is treated to give it a roughness different from the roughness of the other surface.

19. The method as claimed in claim 1, wherein, during the surface treatment phase, either the first or second surface undergoes plasma treatment.

20. The method as claimed in claim 1, wherein during the second phase of application the silicone bonds selectively with the first second layer.

24. The method as claimed in claim 1 less than that of the first surface;

the substrate comprises at least two channels (2), each of which having a respective surface aperture (2′

);

the surface apertures (2′

) are positioned beside each other at the level of the second surface;

the first surface extends around the second surface;

during the second phase of application, the second layer (S) is positioned above the second surface of the substrate so that a perimeter zone of said second layer positioned above the first layer (9) bonds with the first layer (9) itself;

the second layer has a deformable central zone.

28. A valve comprising an article obtained according to the method of claim 1 and an actuator positioned on the opposite side of the second layer (S) with respect to said surface apertures (2′

) to deform the central zone of the second layer and, therefore, connect or maintain isolated the two channels (2).

46. A microfluidic system comprising a valve as claimed in claim 28.

2. The method as claimed in claim herein the first surface of the substrate (4) has an angle of contact of less than 90°

.

6. (canceled)

7. (canceled)

9. (canceled)

11. (canceled)

16. (canceled)

21. A method for bonding a substrate (4) with at least one layer of silicone (S) in order to obtain a composite (V);

the method is characterised in that it comprises

a first phase of application, during which a first layer (9) comprising at least one organosilane is applied to at least one first surface of the substrate (4);

a second phase of application, during which a second layer (S) comprising silicone is applied on the first layer (9);

the organosilane having, during the second phase of application, at least one silicon bonded with at least one hydroxy;

During the first phase of application, the organosilane deposits on the first and a second surface, the method comprising a phase of removal, during which the organosilane is selectively removed from the second surface while remaining on the first surface.

23. The method as claimed in claim 21 wherein the organosilane is removed from the second surface by means of plasma incision.

22. (canceled)

25. (canceled)

26. (canceled)

27. (canceled)

29. A method for the selective deposition of a material on a substrate (4′

), the method comprises a first phase of application, during which the material is selectively deposited on at least one first surface of the substrate (4′

) with respect to a second surface of the substrate (4′

) in order to obtain a first layer (9);

the method is characterised in that the first surface has an angle of contact different from the second surface.

30. The method as claimed in claim 29, wherein during the first phase of application the material is applied by means of evaporation and subsequent condensation on the substrate (4).

31. The method as claimed in claim 29, wherein during the first phase of application the material is applied by means of atomisation and subsequent deposition on the substrate (4).

32. The method as claimed in claim 29, wherein the difference between the angles of contact of the first and second surface is at least 30°

.

33. The method as claimed in claim 29 wherein the difference between the angles of contact of the material and of the first surface is less than the difference between the angles of contact of the material and the second surface.

34. The method as claimed in claim 33, wherein the difference between the angles of contact of the material and the first surface is less than 20°

.

35. The method as claimed in claim 29, and comprising a surface treatment phase, which is previous to the first phase of application and during which either the first or the second surface of the substrate (4;

4′

) is treated in order to present an angle of contact different from an angle of contact of the other surface.

36. The method as claimed in claim 35, wherein, during the surface treatment phase, either the first or the second surface of the substrate is treated to give it a roughness different from the roughness of the other surface.

37. The method as claimed in claim 35, wherein, during the surface treatment phase either the first or the second surface undergoes plasma treatment.

38. The method as claimed in claim 29, wherein the second surface has an angle of contact inferior to an angle of contact of the first surface.

42. The method as claimed in claim 29, and comprising a third phase of application during which a layer of PEG is applied by evaporation or atomisation with subsequent condensation.

39. (canceled)

40. (canceled)

41. (canceled)

43. (canceled)

44. (canceled)

45. A valve comprising an article comprising a second layer (S) which is bonded to the first layer (9);

the substrate (4′

) comprises at least two channels (2), each of which has a respective surface aperture (2′

);

the surface apertures (2′

) are positioned beside each other at the level of the second surface;

the first layer (9) extends around the second surface;

the second layer (S) is positioned above the second surface of the substrate so as to present a perimeter zone bonded to the first layer;

the second layer has a deformable central zone;

the valve further comprising and an actuator positioned on the opposite side of the second layer (S) with respect to said surface apertures (2′

) to deform the central zone of the second layer and, therefore, connect or maintain isolated the two channels (2).