SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
1. A semiconductor device comprising:
- (a) a multilayered wiring board having a first internal wiring and a second internal wiring formed in a layer above the first internal wiring; and
(b) a first semiconductor chip embedded inside the multilayered wiring board,wherein the first semiconductor chip has;
(b1) bump electrodes formed over a main surface of the first semiconductor chip; and
(b2) an insulating film formed over a back surface, which is on the side opposite to the main surface, of the first semiconductor chip,wherein the main surface of the first semiconductor chip is opposed to the side of the first internal wiring formed over the multilayered wiring board,wherein the first internal wiring is coupled with the first semiconductor chip through the bump electrodes, andwherein the back surface of the first semiconductor chip is insulated from the second internal wiring by the insulating film.
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Accused Products
Abstract
In regard to a semiconductor device having a multilayered wiring board where a semiconductor chip is embedded inside, a technology which allows the multilayered wiring board to be made thinner is provided. A feature of the present invention is that, in a semiconductor device where bump electrodes are formed over a main surface (element forming surface) of a semiconductor chip embedded in a chip-embedded wiring board, an insulating film is formed over a back surface (a surface on the side opposite to the main surface) of the semiconductor chip. As a result, it becomes unnecessary to form a prepreg over the back surface of the semiconductor chip. Therefore, an effect of thinning the chip-embedded wiring board in which the semiconductor chip is embedded is obtained.
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Citations
27 Claims
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1. A semiconductor device comprising:
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(a) a multilayered wiring board having a first internal wiring and a second internal wiring formed in a layer above the first internal wiring; and (b) a first semiconductor chip embedded inside the multilayered wiring board, wherein the first semiconductor chip has; (b1) bump electrodes formed over a main surface of the first semiconductor chip; and (b2) an insulating film formed over a back surface, which is on the side opposite to the main surface, of the first semiconductor chip, wherein the main surface of the first semiconductor chip is opposed to the side of the first internal wiring formed over the multilayered wiring board, wherein the first internal wiring is coupled with the first semiconductor chip through the bump electrodes, and wherein the back surface of the first semiconductor chip is insulated from the second internal wiring by the insulating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) preparing a semiconductor chip where a bump electrode is formed over a main surface and a thermosetting insulating film is formed over a back surface; (b) preparing a base board which serves as a core of a multilayered wiring board and in which a first internal wiring is formed; (c) applying a thermosetting resin to a chip mounting region of the base board; (d) after the step (c), coupling the bump electrode formed over the semiconductor chip with the first internal wiring by mounting the semiconductor chip, while heating the semiconductor chip, in the chip mounting region of the base board through the thermosetting resin; (e) after the step (d), applying a heat treatment; (f) after the step (e), forming a first interlayer insulator so as to cover a side surface of the semiconductor chip and to allow the insulating film formed over the back surface, which is on an upper surface side of the semiconductor chip, to be exposed; and (g) after the step (f), forming a second interlayer insulator covering from the first interlayer insulator to the semiconductor chip so that the conductive film may come in contact with the insulating film, the patterned conductive film being pasted to the upper part of the second interlayer insulator, and forming a second internal wiring comprising the conductive film so as to be directly in contact with the insulating film, wherein, by being heated in the steps (d) and (e), in a stage before the step (g), the insulating film is more cured than the insulating film in the step (a). - View Dependent Claims (17, 18, 19, 20, 21)
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22. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) preparing a semiconductor chip where a bump electrode is formed over a main surface and a thermosetting insulating film is formed over a back surface; (b) preparing a base board which serves as a core of a multilayered wiring board and in which a first internal wiring is formed; (c) coupling the bump electrode formed over the semiconductor chip with the first internal wiring by mounting the semiconductor chip in a chip mounting region of the base board; (d) after the step (c), performing a reflow treatment which is a heat treatment; (e) after the step (d), applying an underfill material into a gap between the semiconductor chip and the base board; (f) after the step (e), applying a heat treatment; (g) after the step (f), forming a first interlayer insulator so as to cover a side surface of the semiconductor chip and to allow the insulating film formed over the back surface, which is on an upper surface side of the semiconductor chip, to be exposed; and (h) after the step (g), forming a second interlayer insulator covering from the first interlayer insulator to the semiconductor chip so that the conductive film may come in contact with the insulating film, the patterned conductive film being pasted to the upper part of the second interlayer insulator, and forming a second internal wiring comprising the conductive film so as to be directly in contact with the insulating film, wherein, by being heated in the steps (d), (e), and (f), in a stage before the step (h), the insulating film is more cured than the insulating film in the step (a). - View Dependent Claims (23, 24, 25, 26, 27)
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Specification