SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
First Claim
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1. A semiconductor device, comprising:
- a semiconductor substrate;
a pad region on the semiconductor substrate; and
a bump structure overlying and electrically connected to the pad region;
wherein the bump structure comprises a copper layer and a SnAg layer overlying the copper layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.
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Abstract
A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.
143 Citations
20 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; a pad region on the semiconductor substrate; and a bump structure overlying and electrically connected to the pad region; wherein the bump structure comprises a copper layer and a SnAg layer overlying the copper layer, and the Ag content in the SnAg layer is less than 1.6 weight percent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor assembly comprising:
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a first substrate; a second substrate; and a joint structure disposed between the first substrate and the second substrate; wherein the joint structure comprises a bump structure between the first substrate and the second substrate and a solder layer between the bump structure and the second substrate; and wherein the solder layer comprises silver (Ag), and the Ag content in the solder layer is less than 3.0 weight percent. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of forming a semiconductor device, comprising:
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providing a semiconductor substrate; forming a pad region overlying the semiconductor substrate; forming a copper post over the pad region; forming a lead-free solder layer over the copper post, wherein the lead-free solder layer comprises silver (Ag) and the Ag content in the lead-free solder layer is less than 1.6 weight percent; and reflowing the lead-free solder layer at the temperature between 240°
C. to 280°
C. - View Dependent Claims (19, 20)
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Specification