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3DIC Architecture with Interposer for Bonding Dies

  • US 20110193221A1
  • Filed: 05/05/2010
  • Published: 08/11/2011
  • Est. Priority Date: 02/05/2010
  • Status: Active Grant
First Claim
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1. A device comprising:

  • an interposer substantially free from integrated circuit devices, wherein the interposer comprises;

    a substrate having a first side and a second side opposite to the first side;

    a plurality of through-substrate vias (TSVs) in the substrate;

    a first interconnect structure overlying the first side of the substrate and electrically coupled to at least one of the plurality of TSVs; and

    a second interconnect structure overlying the second side of the substrate and electrically coupled to at least one of the plurality of TSVs;

    a first die bonded onto the first interconnect structure; and

    a second die bonded onto the second interconnect structure.

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