PACKAGE PROCESS
First Claim
1. A package process, comprising:
- disposing a semiconductor substrate on a carrier, wherein the semiconductor substrate has a first surface facing the carrier and plural contacts on the first surface;
thinning the semiconductor substrate from a back side of the semiconductor substrate in opposite to the first surface, wherein the thinned semiconductor substrate has a second surface opposite to the first surface;
forming plural through silicon vias in the thinned semiconductor substrate, wherein the through silicon vias respectively correspond to and connect to the contacts;
forming plural first pads on the second surface of the semiconductor substrate, wherein the first pads respectively correspond to and connect to the through silicon vias;
bonding plural chips to the second surface of the semiconductor substrate, wherein the chips respectively electrically connect to the corresponding first pads;
forming a molding compound on the second surface of the semiconductor substrate, wherein the molding compound covers the chips and the first pads;
separating the semiconductor substrate and the carrier, and forming plural solder balls on the first surface of the semiconductor substrate after the semiconductor substrate and the carrier is separated, wherein the solder balls respectively electrically connect to the corresponding contacts; and
simultaneously sawing the molding compound and the semiconductor substrate to form a plurality of package units.
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Accused Products
Abstract
A package process is provided. The package process includes: disposing a semiconductor substrate on a carrier, wherein the semiconductor substrate has plural contacts at a side facing the carrier; thinning the semiconductor substrate from a back side of the semiconductor substrate and then forming plural through silicon vias in the thinned semiconductor substrate; forming plural first pads on the semiconductor substrate, wherein the first pads respectively connected to the through silicon vias; bonding plural chips to the semiconductor substrate, wherein the chips are electrically connected to the corresponding pads; forming a molding compound on the semiconductor substrate to cover the chips and the first pads; separating the semiconductor substrate and the carrier and then forming plural solder balls on the semiconductor substrate; and sawing the molding compound and the semiconductor substrate.
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Citations
15 Claims
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1. A package process, comprising:
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disposing a semiconductor substrate on a carrier, wherein the semiconductor substrate has a first surface facing the carrier and plural contacts on the first surface; thinning the semiconductor substrate from a back side of the semiconductor substrate in opposite to the first surface, wherein the thinned semiconductor substrate has a second surface opposite to the first surface; forming plural through silicon vias in the thinned semiconductor substrate, wherein the through silicon vias respectively correspond to and connect to the contacts; forming plural first pads on the second surface of the semiconductor substrate, wherein the first pads respectively correspond to and connect to the through silicon vias; bonding plural chips to the second surface of the semiconductor substrate, wherein the chips respectively electrically connect to the corresponding first pads; forming a molding compound on the second surface of the semiconductor substrate, wherein the molding compound covers the chips and the first pads; separating the semiconductor substrate and the carrier, and forming plural solder balls on the first surface of the semiconductor substrate after the semiconductor substrate and the carrier is separated, wherein the solder balls respectively electrically connect to the corresponding contacts; and simultaneously sawing the molding compound and the semiconductor substrate to form a plurality of package units. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A package process, comprising:
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disposing a semiconductor substrate on a carrier, wherein the semiconductor substrate has a first surface facing the carrier and plural contacts on the first surface, and the semiconductor substrate has plural conductive vias inside and the conductive vias respectively correspond to and connect to the contacts; thinning the semiconductor substrate from a back side of the semiconductor substrate in opposite to the first surface, wherein the thinned semiconductor substrate has a second surface opposite to the first surface and a terminal of each of the conductive vias protrudes from the second surface to be a through silicon via; bonding plural chips to the second surface of the semiconductor substrate, wherein the chips respectively electrically connect to the corresponding through silicon vias; forming a molding compound on the second surface of the semiconductor substrate, wherein the molding compound covers the chips; separating the semiconductor substrate and the carrier, and forming plural solder balls on the first surface of the semiconductor substrate after the semiconductor substrate and the carrier is separated, wherein the solder balls respectively electrically connect to the corresponding contacts; and simultaneously sawing the molding compound and the semiconductor substrate to form a plurality of package units. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification