MODULAR, ZONE-SPECIFIC MEDICAL ELECTRICAL LEAD DESIGN

• US 20110197440A1
• Filed: 04/26/2011
• Published: 08/18/2011
• Est. Priority Date: 02/15/2008
• Status: Active Grant

• Current Assignee: Matthew S. Finlay, Reddy G. Shantanu
• Original Assignee: Matthew S. Finlay, Reddy G. Shantanu
• Inventors: Finlay, Matthew S., Reddy, G. Shantanu
• Granted Patent: US 8,099,176 B2
• Time in Patent Office: Days
• US Class Current: 29/876
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: A61N 1/0573 chacterised by means penetrating the heart tissue, e.g. helix needle or hook
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts

Abstract

A medical electrical lead configured to be coupled to a pulse generator in a cardiac rhythm management system. The lead comprises a proximal terminal connector configured for coupling the lead to the pulse generator, and a plurality of longitudinally arranged lead segments each configured to exhibit one or more predetermined physical characteristics based on the implantation location for the respective segment. The lead segments may be pre-fabricated as separate modules optimized for the operating environment and/or delivery requirements of the respective segments. The pre-fabricated modules are longitudinally arranged and joined to form the lead.

Claims

1. A method of making an implantable medical electrical lead, the method comprising:

providing a plurality of pre-fabricated lead modules each corresponding to a lead segment configured for a predetermined implantation site, including;

providing a first module corresponding to a first proximal lead segment;

providing a second module corresponding to a second proximal lead segment; and

providing a third module corresponding to an electrode lead segment; and

longitudinally assembling and joining the first, second and third modules.

2. The method of claim 1, wherein assembling and joining the lead modules includes joining the first module to the second module, the second module to the third module, and the third module to the fourth module.

3. The method of claim 1, further comprising providing a fourth module corresponding to a distal fixation segment and assembling and joining the lead modules further includes joining the third module to the fourth module.

4. The method of claim 3, wherein the first proximal lead segment is configured to be implanted subcutaneously, the second proximal segment is configured to be implanted intravascularly, and the electrode and distal fixation segments are configured to be implanted in a cardiac chamber.

5. The method of claim 4, wherein providing the plurality of lead modules includes configuring each of the modules to exhibit one or more physical characteristics depending on the implantation location of the corresponding segment.

6. The method of claim 5, wherein configuring each of the modules includes:

configuring the first module to exhibit one or more of an enhanced cut resistance, an enhanced crush resistance, an enhanced high temperature resistance, or an enhanced resistance to fibrotic encapsulation, relative to the second, third, or fourth modules.

7. The method of claim 6, wherein configuring each of the modules includes:

configuring the second and the third modules to have a smaller outside diameter and a greater flexibility than the first module.

8. The method of claim 7, wherein configuring each of the modules includes configuring the fourth module to promote tissue ingrowth.

9. The method of claim 8, wherein:

providing the first and second modules includes;

providing first and second lead modules each including a lead body member segment having a first and second longitudinal lumen therethrough;

a first conductor section extending at least partially within the first lumen; and

a second conductor extending at least partially within the second lumen; and

assembling and joining the modules includes;

joining the first conductor section of the first module to the first conductor section of the second module;

joining the second conductor section of the first module to the second conductor section of the second module; and

joining the lead body member sections of the first and second modules.

10. The method of claim 1, wherein providing the third module includes providing a third module including a proximal electrode, a distal electrode, and a spacer portion therebetween.

11. The method of claim 10, wherein the distal fixation segment includes a fixation helix that is configured to deliver a pacing stimulus to the heart.

12. The method of claim 1, wherein providing the plurality of pre-fabricated lead modules includes providing a plurality of lead modules each configured to exhibit one or more predetermined physical characteristics depending on the implantation location of the corresponding segment.

13. The method of claim 11, wherein providing the plurality of lead modules includes:

providing a first module configured to exhibit one or more of an enhanced cut resistance, an enhanced crush resistance, an enhanced high temperature resistance, or an enhanced resistance to fibrotic encapsulation, relative to the second, third, or fourth modules; and

providing a second, third, and fourth module each configured to exhibit a greater flexibility and a smaller outside diameter than the first module.

14. A method of making an implantable medical electrical lead adapted to be at least partially implanted in a heart of a patient and to be coupled to a pulse generator of a cardiac rhythm management system, the method comprising:

configuring each of a plurality of pre-fabricated lead segments to exhibit one or more desired physical characteristics depending on an implantation location of the respective segment, the lead segments including;

at least one segment configured for subcutaneous implantation;

at least one segment configured for intravascular implantation; and

at least one segment configured for intracardiac implantation; and

longitudinally arranging and coupling the lead segments.

15. The method of claim 14, wherein the at least one segment configured for subcutaneous implantation exhibits one or more of a greater stiffness, crush resistance, cut resistance, or temperature resistance than each of the other of the plurality of segments.

16. The method of claim 14, wherein the at least one segment configured for intravascular implantation exhibits one or more of a greater flexibility and smaller outside diameter than the at least one segment configured for subcutaneous implantation.

17. The method of claim 14, wherein the at least one segment configured for intracardiac implantation exhibits one or more of a greater flexibility and smaller outside diameter than the at least one segment configured for subcutaneous implantation;

and

18. The method of claim 14, wherein the at least one segment configured for intracardiac implantation includes:

an electrode segment including at least a first electrode configured to deliver an electrical stimulus to the heart; and

a distal fixation segment including a fixation helix configured to penetrate tissue of the heart to secure the lead thereto and further configured as a second electrode configured to deliver an electrical stimulus to the heart.

19. The method of claim 14, wherein the at least one segment configured for intracardiac implantation includes an electrode located at or near a distal tip of the lead, the electrode configured to deliver a pacing stimulus to the heart.

20. The method of claim 14, wherein the at least one segment configured for subcutaneous implantation includes a reinforcing structure.