COOLING STRUCTURE FOR ELECTRONIC DEVICE, AND A METHOD
First Claim
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1. A cooling structure for an electronic device, the structure comprising:
- an inlet for receiving and conveying a flow in a first flow direction towards a first component located in a first flow channel;
an outlet for conveying the flow from the first component located in the first flow channel; and
a second flow channel, which starts from a port oriented transversely to the first flow direction or away from the first flow direction, the port being located upstream of the first component for receiving part of the flow from the inlet and for conveying the part of the flow to an electronic component located in the second flow channel, and whereinthe second flow channel includes an intermediate space and a component space separated from one another by a partition wall,the intermediate space being located at a beginning of the second flow channel for communicating with the component space through an opening in the partition wall, andan area of the port, through which the flow will enter the intermediate space, being smaller than an area of the opening in the partition wall, through which the flow will pass from the intermediate space into the component space.
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Abstract
This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.
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Citations
10 Claims
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1. A cooling structure for an electronic device, the structure comprising:
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an inlet for receiving and conveying a flow in a first flow direction towards a first component located in a first flow channel; an outlet for conveying the flow from the first component located in the first flow channel; and a second flow channel, which starts from a port oriented transversely to the first flow direction or away from the first flow direction, the port being located upstream of the first component for receiving part of the flow from the inlet and for conveying the part of the flow to an electronic component located in the second flow channel, and wherein the second flow channel includes an intermediate space and a component space separated from one another by a partition wall, the intermediate space being located at a beginning of the second flow channel for communicating with the component space through an opening in the partition wall, and an area of the port, through which the flow will enter the intermediate space, being smaller than an area of the opening in the partition wall, through which the flow will pass from the intermediate space into the component space. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for providing a cooling flow for an electronic component, the method comprising:
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separating a secondary flow from a main flow with a port oriented transversely to a first flow direction or away from the first flow direction; conveying the secondary flow through a component space housing an electronic component to an outlet, the secondary flow being conveyed into the component space through an intermediate space, the component space being separated from the intermediate space by a partition wall; and reducing a flow rate of the secondary flow in the intermediate space located upstream of the component space by conveying the secondary flow into the intermediate space through a port whose area is smaller than an area of an opening through which the secondary flow is conveyed from the intermediate space to the component space.
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Specification