LAMINATE STRUCTURE

• US 20110198116A1
• Filed: 02/17/2011
• Published: 08/18/2011
• Est. Priority Date: 02/18/2010
• Status: Abandoned Application

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: WATARI, Junichi, OKAWA, Yoshihiro
• Application Number:
  US13/029,643
• Publication Number:
  US 20110198116A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: Y10T 428/24347 From both sides

Abstract

According to one embodiment of the present invention, a laminate structure comprises a laminate including a first substrate and a second substrate which is overlapped with the first substrate; and an exterior frame which surrounds a side surface of the laminate, and covers a region of both main surfaces of the laminate. Both of the first substrate and the second substrate have a through hole which is positioned at the region of the both main surfaces of the laminate. The exterior frame comprises a material which has lower elastic modulus than the laminate, and portions of the exterior frame extend into the through holes.

Claims

1. A laminate structure comprising:

a laminate including a first substrate and a second substrate which is overlapped with the first substrate; and

an exterior frame which surrounds a side surface of the laminate, and covers a region of both main surfaces of the laminate;

wherein both the first substrate and the second substrate have a through hole which is positioned at the region of the both main surfaces of the laminate; and

the exterior frame comprises a material which has lower elastic modulus than the laminate, and portions of the exterior frame extend into the through holes.

2. The laminate structure according to claim 1, wherein

the through hole of the first substrate is overlapped with at least a part of the through hole of the second substrate;

and

the portion of the exterior frame extended into the through hole of the first substrate and the portion of the exterior frame extended into the through hole of the second substrate connect to each other.

3. The laminate structure according to claim 1, wherein

the first substrate has a main surface, and the second substrate has a main surface which faces the main surface of the first substrate,

the first substrate has projections at the main surface thereof;

the second substrate has depressions at the main surface thereof; and

the projections fit into the depressions.

4. The laminate structure according to claim 1, wherein

the first substrate has a main surface, and the second substrate has a main surface which faces the main surface of the first substrate,

the first substrate has a projection and a depression at the main surface thereof;

the second substrate has a projection and a depression at the main surface thereof; and

the projection of the first substrate fits into the depression of the second substrate, and the projection of the second substrate fits into the depression of the first substrate.

5. The laminate structure according to claim 4, wherein

the first substrate and the second substrate have substantially the same configuration and are line-symmetric with respect to a first and a second imaginary lines, respectively, and

the projection and the depression of each of the first substrate and the second substrate are arranged on each the first and the second imaginary line.

6. The laminate structure according to claim 4, wherein

each of the first substrate and the second substrate has through holes,

the through holes on the first substrate are arranged symmetrically with respect to a first hypothetical line which is perpendicular to a first line connecting the projection and the depression of the first substrate, is through a center of the first substrate, and is parallel to the first substrate, and

the through holes on the second substrate are arranged symmetrically with respect to a second hypothetical line which is perpendicular to a second line connecting the projection and the depression of the second substrate, is through a center of the second substrate, and is parallel to the second substrate.

7. The laminate structure according to claim 6, wherein

the through holes are classified into a first and a second through hole groups, and

the first through hole group includes three or more through holes near the projection of the first and the second substrate,

the second through hole group includes three or more through holes near the depression of the first and the second substrate,

in each of the first and the second substrate, through holes of the first and second through hole group has a first density at a first region and a second density higher than the first density at a second region nearer to the projection than the first region, and

through holes of the first and second through hole group have a third density at a third region and a fourth density higher than the third density at a fourth region nearer to the depression than the third region.

8. The laminate structure according to claim 1, wherein

the laminate includes a step at the region covered by the exterior frame.

9. The laminate structure according to claim 1, wherein

the first substrate and the second substrate comprise ceramics.

10. The laminate structure according to claim 1, further comprising:

a balance member reducing deviation of an entire weight profile which is obtained by combining a weight profile of the laminate to a weight profile of the exterior frame, the balance member being attached onto the laminate or the exterior frame.

11. The laminate structure according to claim 1, wherein

there is an inner space between the first substrate and the second substrate.

12. The laminate structure according to claim 11, comprising an IC chip inside the inner space.

13. The laminate structure according to claim 12, further comprising a sheet interposed between the first substrate and the second substrate, wherein the sheet has a portion which is in the inner space and is apart from the first substrate and the second substrate, and the IC chip is mounted within the portion of the sheet.