LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS

• US 20110198638A1
• Filed: 02/16/2010
• Published: 08/18/2011
• Est. Priority Date: 02/16/2010
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: WANG, Chung Yu
• Granted Patent: US 8,390,009 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15788 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/18161 of a flip chip
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.

Claims

1. A package system comprising:

a substrate having at least one first thermally conductive structure through the substrate;

at least one second thermally conductive structure disposed over the at least one first thermally conductive structure; and

at least one light-emitting diode (LED) disposed over the at least one second thermally conductive structure.

2. The package system of claim 1, wherein the substrate has a cavity for accommodating the at least one LED.

3. The package system of claim 2, wherein the cavity has a flat surface and at least one beveled surface and the flat surface and the at least one beveled surface form an angle between about 50°

and about 60°

.

4. The package system of claim 2, wherein the at least one LED includes a transparent substrate and a surface of the transparent substrate is substantially level with a surface of the substrate.

5. The package system of claim 4 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is substantially level with the surface of the transparent substrate.

6. The package system of claim 2, wherein the at least one LED includes a transparent substrate and a surface of the transparent surface is lower than a surface of the substrate.

7. The package system of claim 6 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is over the surface of the transparent substrate.

8. The package system of claim 1 further comprising a polymer material around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

9. The package system of claim 1, wherein the at least one first thermally conductive structure includes a through-silicon-via (TSV).

10. The package system of claim 9, wherein the at least one second thermally conductive structure includes a bump structure.

11. A package system comprising:

a substrate having at least one through-silicon-via (TSV) through the substrate;

at least one bump structure disposed over the at least one TSV; and

at least one light-emitting diode (LED) disposed over the at least one bump structure, wherein the substrate has a cavity for accommodating the LED.

12. The package system of claim 11, wherein the cavity has a flat surface and at least one beveled surface and the flat surface and the at least one beveled surface form an angle between about 50°

and about 60°

.

13. The package system of claim 11, wherein the at least one LED includes a transparent substrate and a surface of the transparent surface is substantially level with a surface of the substrate.

14. The package system of claim 13 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is substantially level with the surface of the transparent substrate.

15. The package system of claim 11, wherein the at least one LED includes a transparent substrate and a surface of the transparent surface lower than a surface of the substrate.

16. The package system of claim 15 further comprising a lens material disposed between the substrate and the at least one LED, wherein a surface of the lens material is over the surface of the transparent substrate.

17. The package system of claim 11 further comprising a polymer material around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

18. A package system comprising:

a substrate having at least one through-silicon-via (TSV) through the substrate, wherein the substrate has a cavity, the cavity has a flat surface and at least one beveled surface, and the flat surface and the at least one beveled surface form an angle between about 50° and

about 60°

;

at least one bump structure disposed over the at least one TSV;

at least one light-emitting diode (LED) disposed over the at least one bump structure, wherein the at least one LED includes a transparent substrate and is disposed in the cavity;

a lens material disposed between the at least one LED and the substrate; and

a polymer material disposed around the substrate and extending from a first surface of the substrate to a second surface of the substrate.

19. The package system of claim 18, wherein a surface of the transparent surface and a surface of the lens material are substantially level with the first surface of the substrate.

20. The package system of claim 18, wherein a surface of the transparent surface is lower than the first surface of the substrate and a surface of the lens material is over the surface of the transparent substrate.