LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS
First Claim
Patent Images
1. A package system comprising:
- a substrate having at least one first thermally conductive structure through the substrate;
at least one second thermally conductive structure disposed over the at least one first thermally conductive structure; and
at least one light-emitting diode (LED) disposed over the at least one second thermally conductive structure.
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Abstract
A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
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Citations
20 Claims
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1. A package system comprising:
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a substrate having at least one first thermally conductive structure through the substrate; at least one second thermally conductive structure disposed over the at least one first thermally conductive structure; and at least one light-emitting diode (LED) disposed over the at least one second thermally conductive structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A package system comprising:
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a substrate having at least one through-silicon-via (TSV) through the substrate; at least one bump structure disposed over the at least one TSV; and at least one light-emitting diode (LED) disposed over the at least one bump structure, wherein the substrate has a cavity for accommodating the LED. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A package system comprising:
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a substrate having at least one through-silicon-via (TSV) through the substrate, wherein the substrate has a cavity, the cavity has a flat surface and at least one beveled surface, and the flat surface and the at least one beveled surface form an angle between about 50° and
about 60°
;at least one bump structure disposed over the at least one TSV; at least one light-emitting diode (LED) disposed over the at least one bump structure, wherein the at least one LED includes a transparent substrate and is disposed in the cavity; a lens material disposed between the at least one LED and the substrate; and a polymer material disposed around the substrate and extending from a first surface of the substrate to a second surface of the substrate. - View Dependent Claims (19, 20)
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Specification