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LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS

  • US 20110198638A1
  • Filed: 02/16/2010
  • Published: 08/18/2011
  • Est. Priority Date: 02/16/2010
  • Status: Active Grant
First Claim
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1. A package system comprising:

  • a substrate having at least one first thermally conductive structure through the substrate;

    at least one second thermally conductive structure disposed over the at least one first thermally conductive structure; and

    at least one light-emitting diode (LED) disposed over the at least one second thermally conductive structure.

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